Guide

Thermal and Mechanical Design
14 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Figure 2-2. Processor Package ISO View
Figure 2-3. Processor Package Top and Bottom View
Socket Keying
(4x)
IHS Wings (2x)
Pin 1
Integrated Heat
Spreader (IHS)
Substrate
IHS Step (2x)
Not to Scale
Pin 1
Socket ID
Mark Area
Components
Area (4x)
Integrator Heat
Spreader (IHS)
Land Pattern
(2084 Lands)
Pin 1
Land Side
Components
Not to Scale