Guide

Mechanical Drawings
100 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Figure G-9. ILM Mechanical Drawing - G56693 Rev 2 (Sheet 4 of 4)
13
4
5678
B C D
A
123
4
5678
B C D
A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
90
78
0.25 TYPICAL INSULATOR OVERHANG.
NO METAL IS TO BE
EXPOSED BY INSULATOR
WHERE IT COULD CONTACT
THE CIRCUIT BOARD
1.22 STUD SHOULDER HEIGHT
6.37 STUD HEIGHT. ACCOMODATES
PCB RANGE OF 0.080 TO 0.130
2.2 NOMINAL MATERIAL
INSULATOR WITH ADHESIVE0.178
+0.051 0
()3.59 0.05
A
( 3.51)
G56693 4 2
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
SHEET 4 OF 4
DO NOT SCALE DRAWING
SCALE: 1:1
PMCI
2G56693D
REV
DRAWING NUMBER
SIZE
DEPARTMENT
NOTES; UNLESS OTHERWISE SPECIFIED: 1. FINAL ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS. 2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE. 3. MATERIAL: MAY USE ENGINEERING APPROVED EQUIVALENT. A) TYPE:SHEET STEEL, SK7, 1065, S50C, OR CHSP60PC- 2.2MM+/-0.05 THK B) CRITICAL MECHANICAL PROPERTIES: HEAT TREATED TO 250 MPa MINIMUM YIELD TENSILE YIELD STRENGTH (ASTM D638) >= 250 MPa ULTIMATE TENSILE STRENGTH (ASTM D638) >= 300 MPa C) PLATING: ZINC OR ELECTROLYTIC NICKEL
4 ILM ATTACH STUDS:
- PUSHOUT FORCE > 245N - TORQUE OUT > 1.4N-m 5. AFTER APPLICATION THE INSULATOR MUST BE FREE OF BUBBLES, POCKETS, GREASES, AND ANY OTHER DEFORMATIONS. 6. FOR BACKSIDE KEEP OUT ZONE DETAILS, REFER TO DRAWING G26769
SCALE 2:1
4X (6-32) MAJOR DIAMETER
SEE DETAIL A
SCALE 5:1
DETAIL A
4
4X 4
0.5 AD 0.19 A
0.2
D
4X ( 3.59)
0.25 ABC
0.1
A