Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 35
Reference Thermal Solution 2
7.4 Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are
shown in Figure 7-3 and Figure 7-4.
7.5 Short Torsional Clip Heatsink Thermal Solution
Assembly
The reference thermal solution for the IOH is a passive extruded heatsink with thermal
interface. It is attached using a clip with each end hooked through an anchor soldered
to the board. Figure 7-5 shows the reference thermal solution assembly and associated
components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix B. Appendix A contains vendor information for each thermal
solution component.
Figure 7-2. Short Torsional Clip Heatsink Volumetric Envelope for the IOH
1
Notes:
1. The dimensions shown above are nominal and post SMT.
TNB
Heatsink
65.00 mm
IOH
Short
Heatsink
Die
FCBGA + Solder Balls
Motherboard
IOH
Short
Heatsink
TIM