Guidelines

Intel

7500 Chipset Thermal Mechanical Design Guide 33

Reference Thermal Solution 2

7 Reference Thermal Solution 2

Intel has developed two different reference thermal solutions to meet the cooling needs

of the Intel 7500 chipset under operating environments and specifications defined in

this document. An alternative design that meets the Intel 7500 chipset thermal

performance target is short heatsink thermal solution. The short heatsink solution has

not been validated mechanically on Intel Itanium processor 9300 series platform and

Intel Xeon processor 7500 series-based platform. This section describes the overall

requirements for the short torsional clip heatsink reference thermal solution including

critical-to-function dimensions, operating environment, and validation criteria. Other

chipset components may or may not need attached thermal solutions depending on

your specific system local-ambient operating conditions. For information on the ICH9,

refer to thermal specification in the Intel

ICH9 Thermal Design Guidelines.

Note: The Short heatsink reference thermal solution described in Chapter 6 has been verified

according to the Intel validation criteria given in Section 6.6 and Section 7.6. Any

thermal mechanical design (including short heatsink solution) using some of the

reference components in combination with any other thermal mechanical solution

needs to be fully validated according to the customer criteria. Also, if customer thermal

mechanical validation criteria differ from the Intel criteria, the reference solution should

be validated against the customer criteria. Customers using short heatsink solution

need to conduct their own Solder Joint Reliability (SJR) assessment. System designers

are encouraged to review and assess which design is best suited on their particular

product configuration.

7.1 Operating Environment

See Table 7-1 for Short Heatsink Design Reference Thermal Boundary Conditions.The

reference thermal solution was designed assuming: under the high fan speed condition,

a maximum local-ambient temperature of 53°C and the minimum recommended

airflow velocity through the cross-section of the heatsink fins is 3m/S; under the

acoustic fan speed condition, a maximum local-ambient temperature of 57°C and the

minimum recommended airflow velocity through the cross-section of the heatsink fins

is 1.5m/S.

7.2 Heatsink Performance

Figure 7-1 depicts the simulated thermal performance of the reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction

factor would be required to estimate thermal performance at other altitudes.

Table 7-1. Short Heatsink Design Thermal Boundary Conditions

Acoustic High Speed

Velocity (m/sec) 0.53 0.8

Altitude (m) 900 900

Tsystem_ambient °C 25 35

Trise °C 15 8

Tla °C 40 43