Guidelines

Intel
®
7500 Chipset Thermal Mechanical Design Guide 3
Contents
1 Introduction ..............................................................................................................7
1.1 Design Flow........................................................................................................7
1.2 Definition of Terms..............................................................................................8
1.3 Reference Documents ..........................................................................................8
2 Packaging Technology ...............................................................................................9
2.1 Non-Critical to Function Solder Joints...................................................................12
2.2 Package Mechanical Requirements....................................................................... 13
3 Thermal Specifications ............................................................................................ 15
3.1 Thermal Design Power (TDP) .............................................................................. 15
3.2 Case Temperature............................................................................................. 15
4 Thermal Simulation .................................................................................................17
5 Thermal Metrology .................................................................................................. 19
5.1 Die Temperature Measurements.......................................................................... 19
5.1.1 Zero Degree Angle Attach Methodology ..................................................... 19
6 Reference Thermal Solution..................................................................................... 23
6.1 Operating Environment ...................................................................................... 23
6.2 Heatsink Performance........................................................................................ 24
6.3 Mechanical Design Envelope ...............................................................................25
6.4 Board-Level Components Keepout Dimensions ...................................................... 25
6.5 Tall Torsional Clip Heatsink Thermal Solution Assembly .......................................... 26
6.5.1 Heatsink Orientation............................................................................... 28
6.5.2 Extruded Heatsink Profiles....................................................................... 28
6.5.3 Mechanical Interface Material................................................................... 28
6.5.4 Thermal Interface Material....................................................................... 28
6.5.5 Heatsink Clip ......................................................................................... 29
6.5.6 Clip Retention Anchors............................................................................ 30
6.6 Reliability Guidelines.......................................................................................... 31
7 Reference Thermal Solution 2.................................................................................. 33
7.1 Operating Environment ...................................................................................... 33
7.2 Heatsink Performance........................................................................................ 33
7.3 Mechanical Design Envelope ...............................................................................34
7.4 Board-Level Components Keepout Dimensions ...................................................... 35
7.5 Short Torsional Clip Heatsink Thermal Solution Assembly........................................ 35
7.5.1 Heatsink Orientation............................................................................... 37
7.5.2 Extruded Heatsink Profiles....................................................................... 38
7.5.3 Mechanical Interface Material................................................................... 38
7.5.4 Thermal Interface Material....................................................................... 38
7.5.5 Heatsink Clip ......................................................................................... 39
7.5.6 Clip Retention Anchors............................................................................ 39
7.6 Reliability Guidelines.......................................................................................... 39
8 Design Recommendations for Solder Joint Reliability ..............................................41
8.1 Solder Pad Recommendation............................................................................... 41
8.2 Shock Strain Guidance....................................................................................... 42
A Thermal Solution Component Suppliers ................................................................... 45
A.1 Tall Torsional Clip Heatsink Thermal Solution ........................................................ 45
A.2 Short Torsional Clip Heatsink Thermal Solution......................................................46
B Mechanical Drawings............................................................................................... 49