Nettop Platform for 2008 System Design White Paper

System Testing
White Paper 35
6.1.1.3 Functional, Signal Integrity Validation
Board level validation covers the following functional modules on board with emphasis
on signal integrity:
• Processor Voltage Regulator/Controller gate switching integrity, over current
protection.
• MCH/ICH/Memory core voltage regulators gate switching and over current
protection.
• Memory functional stress test and core voltage stability testing.
• Clock generator, clock source, clock destination phase jitter, rise/fall time signal
integrity.
• ICH core voltage stability, GPIO control signal function requirement.
• IDE PATA functional stress and signal integrity testing.
• TV out Video graphics resolution, composite video signal quality verification.
• Audio codec stereo function and audio precision signal integrity.
• SIO, LAN, SPI flash, Fan Control, PCI slot, USB ports rear and front, PS/2 ports,
Parallel/Serial Ports, Chassis panel header, BIOS recovery testing.
Subjecting board, peripheral devices, and software to temperature chamber variation
and apply supply voltage margining in order to cover all 4 extreme corners of
voltage/temperature requirements.
6.1.1.4 Application and Performance Testing
Various software are used for board level compatibility testing and board is subjected
to testing of generally accepted benchmark test software such as 3DMark2001 (Pro
Build 330), PCMark 2004 Build 120, SysMark 2007.
6.1.2 System Level Testing
6.1.2.1 Thermal Testing
This section describes the system (in-chassis) thermal testing procedures to ensure
appropriate chassis is selected to meet thermal requirements for all components
inside chassis.
The following preparation is required to perform system thermal testing. Consult the
component vendor for latest specification before testing.