Nettop Platform for 2008 System Design White Paper

System Testing
38 White Paper
Figure 16 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view, not to scale)
System Thermal Test Procedures
• Install required software as described in “test preparation”.
• Connect all peripheral components (HDD, ODD, memory, PSU, etc…) to complete
the system setup.
• Attach all thermocouples as described in “thermo couple locations”.
• Ensure all TCs are connected to data logging system.
• Power on system and run test application “DVD playback”.
• Start records all temperature readings for 25–30minutes (assume steady state
thermal equilibrium).
• Repeat above process with other test applications
⎯ PCMark
⎯ SysMark
6.1.2.2 Expected Success Criteria
The expected success criteria for system thermal testing are:
• Case temperatures, T
CASE
equal to or below specifications
• Sub-component ambient temperatures equal to or below targets
6.1.3 Quality and Reliability
The quality and reliability testing will be done in the HW Platform Configuration
described in this document. Sample size: 3 systems for each test.