Intel Core2 Duo Processor E8000 and E7000 Series and Intel Pentium Dual-Core Processor E5000 Series Thermal and Mechanical Design Guidelines

Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 97
24. You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure 7-28 and Figure 7-29).
Figure 7-28. View Through Lens at Solder Station
Figure 7-29. Moving Solder back onto Thermocouple Bead