Nettop Platform for 2008 System Design White Paper

Platform Overview
10 White Paper
3 Platform Overview
3.1 Hardware – Intel
®
Desktop Board D945GCLF
The key components (Processor, Chipsets, LAN) are soldered down on the
motherboard assembly. The Processor and the Chipset reference thermal
solutions are pre-assembled along with the motherboard.
Figure 1 shows the principal functional blocks for the platform. The features summary
is listed in
Table 2. The components location on board are shown in Figure 2. The
board dimensions are available in micro-ATX compatible form factor, which is 6.75” x
6.75”.
Figure 1 Platform Configuration
Intel
®
Atom™
Processo
r