Document

Integration Guide for New Dual-Core Intel

Xeon

Processor-Based Servers (or Workstations) Rev 1.1

Figure 3.3.1 Active solution Figure 3.3.2 2U passive solution

Figure 3.3.3 Combined Active Solution

The boxed Dual-Core Intel® Xeon® processor 5000 sequence requires the heat sink to be directly

attached to the chassis, in order to securely attach the heat sink. As shown in Figure 3.3.4, verify the

Common Enabling Kit (CEK) spring is installed on both processor sockets before motherboard installation.

Refer to your motherboard documentation for more information, or contact your motherboard

manufacturer to obtain a CEK spring for each processor socket if not included with the motherboard.