Document

Integration Guide for New Dual-Core Intel

Xeon

Processor-Based Servers (or Workstations) Rev 1.1

3 Plaform Hardware Requirements

This hardware integration section demonstrates the base line of how to integrate a server system using

a motherboard based on new Dual-Core Intel

Xeon

processors together with an SSI compliant chassis

and power supply, as well as FBDIMM memory and other standard off-the-shelf components. The target

audiences of this integration guideline are system designers and system integrators. The validation of

server functions and performance optimization will not be discussed here.

As a functional server, new Dual-Core Intel

Xeon

processor-based servers should include the following

building blocks:

z Motherboard

z Memory

z Processor and Intel designed thermal solution

z Chassis

z Power supply

z Other system components

3.1 Motherboard Integration

The server boards should be compliant with one of the following Server System Infrastructure (SSI)

specifications for building block compatibility and interchangeability between different blocks:

z EEB 3.61

¾ EEB (Entry- level Electronics Bay) 3.51 for Entry Pedestal Servers and Workstations.

z TEB 2.11

¾ TEB (Thin Electronics Bay) 2.11 for rack mount optimized servers.

z CEB 1.1

¾ CEB (Compact Electronics Bay) 1.1 for value form factor servers.

The following system features are defined by the SSI specification:

z Baseboard maximum volumetric and mounting-hole locations

z Power and signal connector pin-outs

z ATX-compliant I/O aperture and dimensions that define its location

z Chassis keep-out volume and board/processor mounting requirements

USEFUL INTEGRATION TIPS:

z SSI specifications can be obtained from SSI website at http://ww.ssiforum.org

z The motherboard should be SSI-compliant, which defines motherboard dimension, component and

chassis attachment interface, board block layout directions, as well as power connectors