Technical Product Specification

Technical Reference
59
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Issue 2; Method I Case 3 50% electrical stress, 55 ºC ambient. The MTBF prediction is
used to estimate repair rates and spare parts requirements. The MTBF data is
calculated from predicted data at 55 ºC. The MTBF for the Intel Desktop Board
DZ75ML-45K is 244,265 hours.
2.8 Environmental
Table 34 lists the environmental specifications for the board.
Table 34. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
-20
°
C to +70
°
C
(Note)
Operating
0
°
C to +55
°
C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)
<20 36 167
21-40 30 152
41-80
24
136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.