Intel NetStructure® MPCMM0002 Chassis Management Module Hardware Technical Product Specification July 2007 Order Number: 309247-004US
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Contents—MPCMM0002 CMM Contents 1.0 Document Organization ............................................................................................. 8 1.1 Acronyms and Terms ......................................................................................... 10 2.0 Introduction ............................................................................................................ 11 2.1 Architecture Specification ..............................................................................
MPCMM0002 CMM—Contents 10.1 10.2 ESD Discharge Protection....................................................................................54 Chassis Ground and Logic Ground ........................................................................54 11.0 Thermals..................................................................................................................55 11.1 Processor Heat Sink ...........................................................................................55 11.
Contents—MPCMM0002 CMM 18.4 18.5 Instrucciones de Seguridad................................................................................. 87 Chinese Safety Warning ..................................................................................... 89 Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Top View of the Intel NetStructure® MPCMM0002 CMM ................................................. 13 CMM Block Diagram ........................
MPCMM0002 CMM—Contents 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 CDM Health LED States .............................................................................................43 RTM Serial Port Pinout...............................................................................................46 Ethernet Port Pinouts ................................................................................................47 Ethernet Port LED States ....................................................
Revision History—MPCMM0002 CMM Revision History Date Revision Description July 2007 004 July 2007 003 Failure Rate and MTBF values updated. May 2007 002 Quick Start section updated with new CMM removal procedure. CMM dimension drawings updated. April 2006 001 Initial release of this document.
MPCMM0002 CMM—Document Organization 1.0 Document Organization This document describes the operation and use of the Intel NetStructure® MPCMM0002 CMM. The following topics are covered in this document. Chapter 2.0, “Introduction” introduces the key features of the MPCMM0002 CMM. This chapter includes a product definition and a list of product features. Chapter 3.0, “Getting Started” provides installation and setup information for the MPCMM0002 CMM.
Document Organization—MPCMM0002 CMM Chapter 17.0, “Agency Information” contains notices from various certifying agencies. Chapter 18.0, “Safety Warnings” lists important safety warnings in various languages. 1.1 Acronyms and Terms The following special acronyms and terms are used in this specification: Table 1. Acronyms and Terms Acronym/Term Meaning Board Front Board as defined in PICMG 3.
Introduction—MPCMM0002 CMM 2.0 Introduction This chapter provides an overview of the Intel NetStructure® MPCMM0002 CMM (CMM). It includes a product definition and summaries of the module’s hardware features. The CMM’s software features are detailed in the Intel NetStructure® MPCMM0001 Chassis Management Module and Intel NetStructure® MPCMM0002 Chassis Management Module Software Technical Product Specification for version 6.1.
MPCMM0002 CMM—Introduction Key carrier-grade features of the MPCMM0002 CMM include the following: • Full Shelf Management Controller and Shelf Manager capability as defined in the PICMG 3.0 specification. • Support for up to 16 board slots in an AdvancedTCA* chassis. • Hybrid dual IPMB star topology support for improved reliability, security, and throughput. • Compact 4U x 280 mm x 3HP size to simplify integration into shelves. • Comprehensive management interfaces including CLI, SNMP, RPC, and RMCP.
Getting Started—MPCMM0002 CMM 3.0 Getting Started 3.1 Installing the CMM The Intel NetStructure® MPCMM0002 CMM is designed to fit in a variety of compatible chassis and orientations. This chapter provides some useful information for installing the management module in a chassis (shelf), but you will also need to read the thirdparty documentation provided by the chassis manufacturer or system vendor for your chassis before you install the module.
MPCMM0002 CMM—Getting Started 3.1.1 Quick Start 1. Open the packing material, find the packing list, and ensure that all the necessary components are present for the Intel NetStructure® MPCMM0002 CMM. 2. Take the MPCMM0002 CMM to the chassis in which it will be installed. 3. Following standard ESD protection procedures, remove the CMM from its anti-static bag. 4. Insert the management module into the card guides for the dedicated CMM slot.
Module Components—MPCMM0002 CMM 4.0 Module Components 4.1 Block Diagram The block diagram for the Intel NetStructure® MPCMM0002 CMM is shown in Figure 2. Figure 2.
MPCMM0002 CMM—Module Components The major components of the CMM are arranged as shown in Figure 3. Figure 3. CMM Top View Layout Opto Power Brick Bulk Cap Telco + Serial Relay RAM CPU Power Guide Pin + S2 switch Battery LAN B LAN A Flash Debug LED Data FPGA NIC1 NIC2 LED Super Cap J3 M CPLD B5106-01 The PCB is composed of 10 layers of FR406 (or equivalent material). The outer layers (1 and 10) are 0.5 ounce copper (plated to 1.6 ounces); all other layers are 1 ounce copper.
Module Components—MPCMM0002 CMM 4.2 Intel® 80321 Processor The CPU in the MPCMM0002 CMM is an Intel® 80321 Processor/PCI Application Bridge with Intel XScale® technology. The internal block diagram is shown in Figure 4. Figure 4.
MPCMM0002 CMM—Module Components Table 2. Processor Features (Sheet 2 of 2) PCI Local Bus Specification, Rev. 2.2 compliant PCI-X Addendum to the PCI Local Bus Specification, Rev. 1.
Module Components—MPCMM0002 CMM 4.3 Memory The CMM has a SODIMM (Small Outline Dual Inline Memory Module) socket on board. The SODIMM is populated with a 128 MByte unbuffered memory module. The CMM also has four separate 16 MByte flash modules. These are Intel® E28F128 flash memory modules. Each memory module has multiple lockable regions within the flash. 4.4 Ethernet The CMM has two Intel® 82551QM Fast Ethernet Multifunction Controllers with integrated media access controllers and physical interfaces.
MPCMM0002 CMM—Module Components 4.6 FPGA The MPCMM0002 CMM has two redundant field-programmable gate arrays (FPGAs) on board. These two Xilinx* Spartan* II XC2S200 FPGAs have identical internal design, but different addresses. A brief summary of the FPGA functions is shown in Table 3. Table 3. FPGA Features Signal Description IPMI 1.5-compliant buses, pulled up to 3.
Module Components—MPCMM0002 CMM 4.10 ADM1026 Controller An Analog Devices* ADM1026 controller monitors the on-board voltages and manages the thermal sensors. The processor communicates with the ADM1026 through an I2C bus. 4.11 Hot Swap Controller The CMM uses an LTC4250AH* Hot Swap controller to ramp voltages and watch for over-current conditions. If the CMM draws more than 2.5 A for more than 500 µs, the Hot Swap controller terminates.
MPCMM0002 CMM—Module Components Figure 5. IPMB Dual Star Isolation CMM 1 IP MB_P W R IP MB_P W RG OO D FPGA1 IP MBa IP MB_P W R IP MB_P WRG OOD FPGA2 IP IP MBb MBb SLOT a or CD Ma CMM 2 IP MB_P W R IP MB_ P W RG OOD FPGA1 SLOT b or CD Mb IP MBa IP MB_P W R IP MB_P W RGO OD FPGA2 IP IP MBb MBb 4.13.2 Dual Bus IPMB Isolation Requirements The isolation requirements for a dual bus IPMB are more stringent.
Module Components—MPCMM0002 CMM Figure 6.
MPCMM0002 CMM—Mechanical Information 5.0 Mechanical Information 5.1 Dimensions Dimensions for the CMM are shown in Figure 7. The origin is in the lower right corner. All dimensions are shown in millimeters. The form factor of the CMM PCB has a height of 144.4 mm and a depth of 282.5 mm. The faceplate has a horizontal slot pitch (width) of 3 HP (0.6 inches). Dimensions for the CMM backing plate are shown in Figure 8. The origin for these dimensions is based on the mounting hole in the upper left corner.
Mechanical Information—MPCMM0002 CMM Figure 8.
MPCMM0002 CMM—Mechanical Information The gasket is on the secondary side of the backing plate and extends over the pitch line, just as PICMG 3.0 boards extend their gasket over the pitch line. The outer face of the backing plate is 0.15 mm (0.0059 inches) inside the nearest pitch line. Since the gasket has a nominal compressed size of 1.53 mm (0.0602 inches) and a four-sigma range of 0.99 mm (0.0390 inches) to 2.07 mm (0.0815 inches), the gasket must seal on a surface that is between 0.84 mm (0.
Mechanical Information—MPCMM0002 CMM There is only one ejector on the CMM, but it matches the subrack interface geometry defined in Section 2.2.7 of the PICMG 3.0 specification. Note, however, that the ejector handle is 2 mm (0.0787 inches) thick, not the 2.5 mm (0.0984 inches) thickness that many PICMG 3.0 boards use. A switch on Component Side 2 of the PCB detects the opening and closing of the ejector handle. 5.3 Rear Connector Placement 5.3.
MPCMM0002 CMM—Backplane Considerations 6.0 Backplane Considerations 6.1 IPMB Routing The Intel NetStructure® MPCMM0002 CMM is designed to support a hybrid dual IPMB star topology. The CMMs can support up to 16 slots, the maximum number of boards in a PICMG* 3.0 chassis. Each board in the subrack has two dedicated IPMBs going to it. Each IPMB is arranged in a ‘Y’ pattern: the connection from the board is split to two legs, one going to each CMM. Each CMM is present on both buses to each board.
Backplane Considerations—MPCMM0002 CMM Figure 11. Power System Block Diagram 3.3V -48V -48V to 3.3V Power Brick Filt er Cap P ower Enable (MLBF) Hotswap Controller 5V LT1371 12V -48VRet urn LT1930 2.5V TPS54610 ADM1026 PG33 1.3V CPLD PG5 TPS54610 Discrete Linear Regulator Table 4. 1.25V Voltage Usage Voltage Max Current 12 V 0.3 A Where Used Op Amp and IPMB isolation circuit Monitored By ADM1026 5V 1A Misc components that cannot use 3.3 V ADM1026 3.
MPCMM0002 CMM—Backplane Considerations Figure 12. CDM Power Input CDM 1 6.2.3 CDM 2 Filter Tray The CMM also provides direct support for a filter tray. The CMM provides signals to handle a filter presence switch, two thermistors, and a tricolor LED. The filter presence switch is typically a mechanical switch that connects the AF_PRES# signal to ground when an air filter is installed in the chassis. The switch is debounced in software.
Backplane Considerations—MPCMM0002 CMM Table 5. Chassis Elements Directly Driven by CMM Hardware Chassis Element CDM Filter Tray 6.2.5 Component Notes EEPROM + others 50 mA @ 5 V max; typically uses series resistance to drop voltage to 3.3.V.
MPCMM0002 CMM—Rear Connections 7.0 Rear Connections 7.1 CMM Connector Pinouts Each CMM has a power connector and a data connector. 7.1.1 CMM Power Connector The CMM power connectors are standard J12 power receptacles as shown in Figure 14. Figure 14.
Rear Connections—MPCMM0002 CMM The pinout of each CMM power connector is shown in Table 6. Table 6.
MPCMM0002 CMM—Rear Connections Table 7 labels the pins on the power connector at the intersection of each row (A-E) and column (1-12). Table 7.
Rear Connections—MPCMM0002 CMM Table 9. Power Connector Receptacle Pin Placement (Sheet 2 of 2) E 5 4 2 Table 10.
MPCMM0002 CMM—Rear Connections 7.1.2 CMM Data Connector The CMM data connector is a J16 signal connector. See Figure 15. Figure 15.
Rear Connections—MPCMM0002 CMM The pinouts for the data connector are shown in Table 11. Table 11. Data Connector Pinouts (Sheet 1 of 2) Signal Name Count Type 1 I BP_AFT1 Description Pin Name From Table 12 Filter tray ambient temperature thermistor A E16 BP_AFT2 1 I Filter tray ambient temperature thermistor B E17 BP_AFTREF 1 I Filter tray ambient temperature thermistor return E18 BP_AFLED[1:2] 2 O Filter tray status tri-color LED control. Bit 1 controls the red LED.
MPCMM0002 CMM—Rear Connections Table 11.
Rear Connections—MPCMM0002 CMM Table 12.
MPCMM0002 CMM—Rear Connections Table 12.
Rear Connections—MPCMM0002 CMM Figure 16. Cross-Connected CMM Signals CMM 1 7.2 Backplane CMM 2 NGO NGO NGOI NGOI HLY# HLY# HLYI# HLYI# PRES# PRES# PRESI# PRESI# Guide Post The guide post is FCI 73474-201 as shown in Figure 17. Figure 17. Guide Post to Backplane 7.3 CMM Redundancy When a chassis is powered up, the CMM determines which of the two CMMs is initially active.
MPCMM0002 CMM—Rear Connections • BD_SEL# bit is set low indicating the CMM is properly inserted. • OSL bit is set high indicating the OS is loading. If one CMM detects an internal failure that cannot be corrected through software, it will deassert its HLY# signal. If the faulty CMM is the active CMM, the standby CMM becomes the active CMM as soon as it sees the HLYI# signal rise.
Chassis Data Modules (CDMs)—MPCMM0002 CMM 8.0 Chassis Data Modules (CDMs) 8.1 CDM Overview The CDM (Shelf FRU) is a repository of chassis-specific information (such as serial number of the chassis and backplane), capabilities of the system (number of slots, maximum power per slot, whether dual star or mesh, etc.), and a few administratordefinable configuration options. The latter category allows the administrator to define more conservative limits than the maximum shelf ratings.
MPCMM0002 CMM—Chassis Data Modules (CDMs) together, how the Update Channels are routed, how many slots are in the system, and what is the maximum power to each slot or group of slots. The CDM provides the information required of a shelf FRU as defined in the PICMG* 3.0 specification. Only the CMMs can directly access the CDMs (via the dedicated I2C buses). 8.4 CDM Power The CDM is provided a dedicated power signal, which is a diode-OR’d 5 V output from each of the CMMs.
Front Panel—MPCMM0002 CMM 9.0 Front Panel The front panel of the MPCMM0002 CMM has several connectors, as shown in Figure 19. Figure 19. CMM Front Panel Each part of the front panel is described in more detail in the following sections. 9.1 Serial Port Pinouts Each CMM has two serial ports; one goes to the front and one goes to the rear for an RTM connection. An RJ-45 connector is used for the front cabling connection, in line with common industry practice.
MPCMM0002 CMM—Front Panel Figure 20. Serial Port RJ-45 Connector B5105-01 Figure 21. Serial Port RJ-45 Cabling Table 15.
Front Panel—MPCMM0002 CMM Table 15. 9.2 RTM Serial Port Pinout Pin Signal Description 6 RXD Receive Data 7 DSR Data Set Ready 8 CTS Clear To Send Ethernet Port Pinouts The CMM faceplate has two Fast Ethernet ports. The two Ethernet channels can be switched via software to the backplane connections or the RTM connections, but the default state is for the Ethernet ports to come out the front of the CMM.
MPCMM0002 CMM—Front Panel There are two LEDs for each Ethernet port. . Table 17. Ethernet Port LED States LED (Color) Yellow LED Green LED 9.3 Status Description Off 10 Mbps Connection On 100 Mbps Connection Off No Link Blinking Transmission Activity Solid On Link established, but no activity Telco Alarm Connector Many telecom facilities have existing alarm infrastructure.
Front Panel—MPCMM0002 CMM Table 18. Telco Alarm Pinout Pin Description Pin Description 1 MinorReset + 9 2 MinorReset - 10 MinorAlarm - COM 3 MajorReset + 11 MajorAlarm - NO 4 MajorReset - 12 MajorAlarm - NC 5 CriticalAlarm - NO 13 MajorAlarm - COM 6 CriticalAlarm - NC 14 PwrAlarm - NO 7 CriticalAlarm - COM 8 MinorAlarm - NO 15 PwrAlarm - COM MinorAlarm - NC The signals on the alarm connector can be up to –72 VDC. The relay handles currents up to 1 A. 9.3.
MPCMM0002 CMM—Front Panel Figure 25. Failure Scenario with Dual Telco Alarm Connectors MxxResetInput Input Note: MxxReset= MajReset or MinReset MxxReset+ CMM 1 CMM 2 MxxReset- Failure or Removal Input Input MxxReset+ No Real Effect Telco alarm inputs from multiple connectors are wired parallel to each other. The absence or failure of one connection will not affect the ability to recognize an input from the other connection.
Front Panel—MPCMM0002 CMM A cable to connect the two telco alarms together is shown in Figure 27. Connector A goes to the facility’s alarm panel, while connectors B and C go to the RTM connectors for CMM 1 and CMM 2. Figure 27. Cascaded Telco Alarm Cables B C CMM 1 CMM 2 A Pinouts for the cables to match the diagram in Figure 27 are shown in Table 19. Since the CMMs that drive the telco alarm signals are normally kept synchronized, either of the cables described in this table should work.
MPCMM0002 CMM—Front Panel If the alarm quiet switch is held in for more than five seconds, the processor on the CMM is reset. This is functionally equivalent to ejecting and re-inserting the CMM in the chassis. 9.5 LEDs Figure 28 shows the LEDs on the front panel of the MPCMM0002 module. Figure 28. CMM Front Panel with Labels 9.5.1 Alarm LEDs There are three alarm LEDs, corresponding to the minor (!), major (!!), and critical (!!!) alarm states. The LEDs are amber when on.
Front Panel—MPCMM0002 CMM 9.5.2 Health LED Each CMM maintains a single health LED (®) to indicate the status of the CMM. Possible states are described in Table 21. Table 21. 9.5.
MPCMM0002 CMM—Grounding Considerations 10.0 Grounding Considerations 10.1 ESD Discharge Protection The MPCMM0002 CMM has ESD discharge strips on its lower edge. Refer to Section 5.4, “ESD Discharge Strip” on page 27 for more information. 10.2 Chassis Ground and Logic Ground Section 4.2.3 of the PICMG 3.0 specification recommends that each FRU have a jumper to tie logic ground and chassis ground together.
Thermals—MPCMM0002 CMM 11.0 Thermals 11.1 Processor Heat Sink The MPCMM0002 CMM chassis management module has a heat sink on the 80321 processor to aid CMM cooling. This heat sink is a modified pin grid array as shown in Figure 29. Figure 29. CMM Heat Sink This heat sink provides similar cooling results with either a vertical or horizontal airflow. 11.
MPCMM0002 CMM—Thermals Figure 30. Side-to-Side Air Flow The MPCMM0002 CMM module supports a front-to-back airflow path as well. This is most useful when the CMM is installed perpendicular to the main subrack, such as horizontally above or below a vertical subrack. Since there is no airflow through the front panel or through most backplanes, chassis designers must ensure that they direct sufficient airflow across the major components on the PCB, including the 80321 processor.
Thermals—MPCMM0002 CMM Figure 31. Front-to-Back Air Flow It may be necessary to enclose the area around a CMM when cooled front-to-back to ensure that air is properly channeled across the board and evenly distributed. 11.4 Airflow Requirements General airflow requirements for the CMM are shown in Table 23. Table 23. Typical Airflow and Cooling Requirements Category 11.5 CMMs Required LFM 180 LFM (54.864 m/min) Required CFM 5 CFM (0.
MPCMM0002 CMM—Thermals As a guideline, the MPCMM0002 CMM requires the airflow in Table 24. . Table 24. Airflow Guidelines Minimum Air Flow Air Temp Rise 3.3 cfm (0.0934 m3/min) 15° C (59° F) m3/min) 10° C (50° F) 4.9 cfm (0.1388 11.6 Thermal Sensors Proper thermal design is critical to the successful deployment of the MPCMM0002 CMM chassis management module. In the event sufficient airflow is not provided, the CMM has three levels of thermal protection: 1.
Management Module Specifications—MPCMM0002 CMM 12.0 Management Module Specifications 12.1 Feature Summary Key carrier-grade features of the Intel NetStructure® MPCMM0002 CMM include the following: • Full shelf management controller and shelf manager capability as defined in the PICMG 3.0 specification with support for up to 16 board slots in an AdvancedTCA* chassis. • Hybrid dual IPMB star topology support for improved reliability, security, and throughput. • Slim 4U x 282.
MPCMM0002 CMM—Management Module Specifications 12.2 Dimensions and Weight Table 25. Dimensions and Weight Attribute Height Width Value 177 mm (6.9685 inches) faceplate 144.5 mm (5.6890 inches) PCB 15.24 mm (0.6 inches) (3HP) faceplate Depth 280 mm (11.0236 inches) PCB Shipping Weight 0.9 kg (2.0 lbs) See Section 5.1, “Dimensions” on page 24 for more information. 12.3 Environmental Characteristics Table 26.
Management Module Specifications—MPCMM0002 CMM Table 27. Reliability Estimate Data Reliability Measure Value Units Failure Rate (FITs) 8348.26 Failures in 109 hours MTBF 119,785 Hours 12.4.1 Assumptions and Notes 12.4.1.1 Environmental Assumptions 1. Failure rates are based on a 40o C (104o F) ambient temperature. 2. Applied component stress levels are 50 percent (voltage, current, and/or power). 3. Ground, fixed, controlled environment with an environmental adjustment factor equal to 1.0.
MPCMM0002 CMM—Guidelines for Third Party Chassis Vendors 13.0 Guidelines for Third Party Chassis Vendors This chapter describes some of the high level design of the Intel NetStructure® MPCMM0002 Chassis Management Module to help third party chassis vendors better understand how to incorporate the CMM into their chassis. Note: The chapter excludes any low level design details of the individual components of the Chassis Management Module or the CMM firmware.
Guidelines for Third Party Chassis Vendors—MPCMM0002 CMM Figure 33. I/O Signals of the CMM Dedicated I/IO signals Analog Input 1 Analog Input 2 Analog Ground 7 GPIOs SMBus ADM 1026 FPGA1 21 IPMB-A buses 13.2 CPU FPGA2 10 GPIOs 21 IPMB-B buses IPMB Buses Figure 33 illustrates 42 IPMB buses emanating out of the two FPGAs, 21 buses from each. Taken together, all buses are numbered 1 through 42.
MPCMM0002 CMM—Guidelines for Third Party Chassis Vendors Table 28.
Guidelines for Third Party Chassis Vendors—MPCMM0002 CMM Figure 34. Radial Bus Topologya Non-Intelligent FRUs PEM1 ADM 1026 PEM1 ADM 1026 Fantray1 ADM 1026 i2C Bus I2c Bus Shelf FRU1 I2c Bus Shelf FRU2 FPGAs FPGAs Standby ShMC Active ShMC ATCA Board1 IPMC ATCA Board2 IPMC IPMB A IPMB B a. The ADM1026 shown in the PEMs and the fan tray is just one possible I2C controller that can be used.
MPCMM0002 CMM—Guidelines for Third Party Chassis Vendors Figure 35. Shared Bus Topologya Non-Intelligent FRUs PEM1 ADM 1026 PEM1 ADM 1026 Fantray1 ADM 1026 i2C Bus i2C Bus Shelf FRU1 i2C Bus Shelf FRU2 FPGAs FPGAs Standby ShMC Active ShMC IPMC IPMC IPMC ATCA Board1 ATCA Board2 ATCA BoardN IPMB A IPMB B a. The ADM1026 shown in the PEMs and the fan tray is just one possible I2C controller that can be used. 13.
Guidelines for Third Party Chassis Vendors—MPCMM0002 CMM • Three are wired to the Analog Devices* Complete Thermal System Management Controller ADM1026* on the CMM. Two of them (BP_AFT1 and BP_AFT2) can only be used for temperature readings from two different thermistors (which may be located anywhere on the chassis). These provide analog input via pins 35 (AIN6) and 34 (AIN7). The third pin must be used for thermistor return (BP_AFTREF), and is grounded via pin 21 (AGND) on the ADM1026. 13.
MPCMM0002 CMM—Guidelines for Third Party Chassis Vendors • Bus #41, configured as I2C bus, used solely by FRU2 13.4.1.
Guidelines for Third Party Chassis Vendors—MPCMM0002 CMM Figure 36. FRU That Uses the ADM1026 Monitor fan voltage for all 3 fans AIN(3) AIN(4) AIN(5) FPGA1 IPMB-A[1] SDA I2c Data IPMB-A[1] SDA I2c Clock PWM Fan1 Tach SDA FANTK0/GPIO0 SCL FANTK1/GPIO1 HS Button GPIO9 Fan2 Tach Fan3 Tach HS LED FANTK2/GPIO2 GPIO10 CMM ADM 1026 Health LED GPIO11 User LED1 GPIO12 User LED2 FPGA2 GPIO13 GPIO 1 Fan Tray Presence signal 13.6.
MPCMM0002 CMM—Guidelines for Third Party Chassis Vendors 13.9 Controllers and I/O Ports for Non-Intelligent Devices Version 6.1 of the CMM firmware for the MPCMM0002 supports the Analog Devices* ADM1026 and the Philips Semiconductors* PCA9555 devices for communicating with non-intelligent power entry modules (PEMs), fan trays, and any other devices that are fronted by the CMM. 13.
Warranty Information—MPCMM0002 CMM 14.0 Warranty Information 14.
MPCMM0002 CMM—Warranty Information 14.3 For the Americas Return Material Authorization (RMA) credit requests e-mail address: requests.rma@intel.com Direct Return Authorization (DRA) repair requests e-mail address: uspss.repair@intel.com DRA on-line form: http://support.intel.com/support/motherboards/draform.htm Intel Business Link (IBL): http://www.intel.com/ibl Telephone No.: 1-800-INTEL4U or 480-554-4904 Office Hours: Monday - Friday 0700-1700 MST Winter / PST Summer 14.3.
Warranty Information—MPCMM0002 CMM If the Customer Support Group verifies that the product is defective, they will have the Direct Return Authorization/Return Material Authorization Department issue you a DRA/ RMA number to place on the outer package of the product. Intel cannot accept any product without a DRA/RMA number on the package.
MPCMM0002 CMM—Customer Support 15.0 Customer Support 15.1 Customer Support This chapter offers technical and sales assistance information for this product. Information on returning an Intel NetStructure® product for service is in the following chapter. 15.2 Technical Support and Return for Service Assistance For all product returns and support issues, please contact your Intel product distributor or Intel Sales Representative for specific information. 15.
Certifications—MPCMM0002 CMM 16.
MPCMM0002 CMM—Certifications Material Declaration Data Sheet Intel NetStructure® MPCMM0002 ATCA Chassis Management Module MPCMM0002Q Pb Free Product: Product Weight (grams): Manufacturer: revised: 561.7 Intel Corporation 4/3/2006 yes Restriction on Hazardous Substances (RoHS) Compliance RoHS Definition Quantity limit of 0.1% by mass (1000 PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl * Ethers (PBDE) Quantity limit of 0.
Agency Information—MPCMM0002 CMM 17.0 Agency Information 17.1 North America (FCC Class A) FCC Verification Notice This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation 5200 N.E.
MPCMM0002 CMM—Agency Information 17.3 Safety Instructions (English and French-translated below) 17.3.1 English CAUTION: This equipment is designed to permit the connection of the earthed conductor of the d.c. supply circuit to the earthing conductor at the equipment. See installation instructions.
Agency Information—MPCMM0002 CMM 17.5 Japan VCCI Class A 17.6 Korean Class A 17.
MPCMM0002 CMM—Safety Warnings 18.0 Safety Warnings Caution: Review the following precautions to avoid personal injury and prevent damage to this product or products to which it is connected. To avoid potential hazards, use the product only as specified. Read all safety information provided in the component product user manuals and understand the precautions associated with safety symbols, written warnings, and cautions before accessing parts or locations within the unit.
Safety Warnings—MPCMM0002 CMM Warning: Avoid electric overload, heat, shock, or fire hazard: Only connect the system to a to a properly rated supply circuit as specified in the product user manual. Do not make connections to terminals outside the range specified for that terminal. See the product user manual for correct connections. Warning: Avoid electric shock: Do not operate in wet, damp, or condensing conditions.
MPCMM0002 CMM—Safety Warnings IMPORTANT : reportez-vous aux instructions d'installation avant de connecter le bloc d'alimentation. Pour les systèmes C.A., utilisez uniquement un câble d'alimentation avec une prise de terre et établissez toujours les connexions à une prise secteur mise à la terre. Chaque câble d'alimentation doit être connecté à un circuit terminal dédié. Pour les systèmes C.C., la protection de cette unité repose sur les coupe-circuits (surintensité) du bâtiment.
Safety Warnings—MPCMM0002 CMM Attention : exigences environnementales du système : les composants tels que les cartes de processeurs, les commutateurs Ethernet, etc., sont conçus pour fonctionner avec un flux d'air externe. Les composants peuvent être détruits s'ils fonctionnent dans d'autres conditions. Le flux d'air externe est généralement produit par les ventilateurs des châssis lorsque les composants sont installés dans des châssis compatibles.
MPCMM0002 CMM—Safety Warnings Gleichstromsysteme: Dieses Gerät basiert auf dem im Gebäude installierten Schutz vor Kurzschlüssen (Netzüberlastung). Stellen Sie sicher, dass für alle stromführenden Leiter eine zertifizierte Sicherung oder ein Leistungsschalter mit nicht mehr als 72V Gleichstrom, 15A verwendet wird. Für Geräte, die ständig angeschlossen sind, sollte in der Gebäudeverkabelung ein leicht zugänglicher Trennschalter installiert werden.
Safety Warnings—MPCMM0002 CMM Warnung: Die Kühlkörper des Geräts können sich während des normalen Betriebs erhitzen: Um Verbrennungen zu vermeiden, sollte jeder Kontakt mit den Kühlkörpern vermieden werden. Warnung: Vermeiden Sie Verletzungen, Feuergefahr oder Explosionen: Unterlassen Sie den Betrieb dieses Produkts in einer explosionsgefährdeten Betriebsumgebung. Vorsicht: Lithiumbatterien. Bei unsachgemäßem Austausch oder Umgang mit Batterien besteht Explosionsgefahr.
MPCMM0002 CMM—Safety Warnings Per ridurre il rischio di scariche elettriche da parte della linea telefonica o dalla rete Ethernet*, collegare l'unità all'alimentazione principale prima di effettuare tale collegamento. Rimuovere i collegamenti prima di togliere l'alimentazione principale all'unità. NORME DI SICUREZZA PER LE UNITÀ MONTATE IN UN RACK. Questa unità può essere alloggiata in modo permanente in un rack.
Safety Warnings—MPCMM0002 CMM Attenzione: le batterie al litio. La sostituzione o l'uso non corretto della batteria comporta un rischio di esplosione. Non smontare né ricaricare la batteria. Non gettare la batteria nel fuoco. Per la sostituzione, usare il tipo di batteria identico (CR2032) o equivalente consigliato dal costruttore. Le batterie usate devono essere smaltite rispettando le istruzioni del costruttore. Avvertenza: evitare le lesioni.
MPCMM0002 CMM—Safety Warnings PROCEDIMIENTOS DE SEGURIDAD PARA EL CHASIS DE MONTAJE EN BASTIDOR: Esta unidad puede estar preparada para su montaje en un bastidor estático. Un montaje de este tipo deberá realizarse en un bastidor que cumpla con los requisitos de robustez de las normas NEBS GR-63-CORE y NEBS GR 487. Desconecte cualquier tipo de alimentación y conexiones externas antes de instalar la unidad en un bastidor o desmontarla.
Safety Warnings—MPCMM0002 CMM Advertencia: Daños personales: Este producto puede contener uno o varios dispositivos láser, que estarán a la vista dependiendo de los módulos enchufables que se hayan instalado. Los productos provistos de un dispositivo láser deben ajustarse a la norma 60825 de la International Electrotechnical Commission (IEC). 18.
MPCMM0002 CMM—Safety Warnings Intel NetStructure® MPCMM0002 Chassis Management Module Hardware TPS 90 July 2007 Order Number: 309247-004US
Working page only. Do not distribute. 1.0 Document Organization ............................................................................................. 8 1.1 Acronyms and Terms ......................................................................................... 10 2.0 Introduction ............................................................................................................ 11 2.1 Architecture Specification ........................................................................
Working page only. Do not distribute. 11.0 Thermals..................................................................................................................55 11.1 Processor Heat Sink ...........................................................................................55 11.2 Module Orientation.............................................................................................55 11.3 Module Airflow Path ................................................................................
Working page only. Do not distribute. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Top View of the Intel NetStructure® MPCMM0002 CMM ................................................. 13 CMM Block Diagram ................................................................................................. 15 CMM Top View Layout...............................................................................................
Working page only. Do not distribute. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 Acronyms and Terms ................................................................................................10 Processor Features ...................................................................................................17 FPGA Features .........................................................................................................20 Voltage Usage..............
