Technical product specification

Contents
ix
3.9 Adjusting Boot Speed ........................................................................ 89
3.9.1 Peripheral Selection and Configuration ..................................... 89
3.9.2 BIOS Boot Optimizations ........................................................ 89
3.10 Hard Disk Drive Password Security Feature .......................................... 90
3.11 BIOS Security Features ..................................................................... 91
3.12 BIOS Performance Features ............................................................... 92
4 Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 93
4.2 BIOS Beep Codes ............................................................................. 93
4.3 Front-panel Power LED Blink Codes ..................................................... 94
4.4 BIOS Error Messages ........................................................................ 94
4.5 Port 80h Power On Self Test (POST) Codes .......................................... 95
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 101
5.1.1 Safety Standards.................................................................. 101
5.1.2 European Union Declaration of Conformity Statement ............... 102
5.1.3 Product Ecology Statements .................................................. 103
5.1.4 China RoHS ......................................................................... 106
5.1.5 EMC Regulations .................................................................. 107
5.1.6 e-Standby and ErP Compliance .............................................. 109
5.1.7 Regulatory Compliance Marks (Board Level) ............................ 110
5.2 Battery Disposal Information ............................................................. 111
Figures
1. Major Board Components (Top) .......................................................... 15
2. Major Board Components (Bottom) ..................................................... 17
3. Block Diagram .................................................................................. 18
4. Memory Channel and SO-DIMM Configuration ...................................... 23
5. Flat Panel Connectors ........................................................................ 26
6. Back Panel Audio Connectors ............................................................. 32
7. Internal Audio Headers ...................................................................... 33
8. L
AN Connectors LED Locations ........................................................... 35
9. Thermal Sensors and Fan Headers ...................................................... 37
10. Location of the Intel ME “M” State LED ................................................ 42
11. Location of the Standby Power LED ..................................................... 48
12. Detailed System Memory Address Map ................................................ 50
13. Back Panel Connectors ...................................................................... 52
14. Connectors and Headers (Top) ........................................................... 53
15. Connectors and Headers (Bottom) ...................................................... 55
16. Connection Diagram for Front Panel Header ......................................... 65
17. Connection Diagram for Front Panel USB 2.0 Dual-Port Headers ............. 67
18. Connection Diagram for the Front Panel USB 2.0 Single-Port Header ....... 67
19. Half-Height Back Panel I/O Shield ....................................................... 68
20. Standard-Height Back Panel I/O Shield................................................ 69