Datasheet

Intel Desktop Board DQ67OW Technical Product Specification
66
2.8 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia
"Reliability Prediction Procedure for Electronic Equipment" SR-332 Issue 1, an update
of Bellcore TR-332, Issue 6. The MTBF prediction is used to estimate repair rates and
spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
221,007.51 hours.
2.9 Environmental
Table 32 lists the environmental specifications for the board.
Table 32. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
-40 °C to +60 °C
(Note)
Operating
0
°
C to +40
°
C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.