DP67DE Technical Product Specification

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1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by

243.84 millimeters])

Processor

• Intel

Core™ i7, Intel

Core™ i5, and Intel

Core™ i3 processors with up to

95W TDP in an LGA1155 socket

― One PCI Express* 2.0 x16 graphics interface

― Integrated memory controller with dual channel DDR3 memory support

Memory

• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 32 GB of system memory with four DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

• Support for 1.35 V low voltage JEDEC memory

Chipset

Intel

P67 Express Chipset consisting of the Intel

P67 Express Platform

Controller Hub (PCH)

Graphics Discrete graphics support for PCI Express 2.0 x16 add-in graphics card

Audio

10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio

codec

Peripheral

Interfaces

• Two USB 3.0 ports are implemented with stacked back panel connectors

(blue)

• Fourteen USB 2.0 ports:

― Six ports are implemented with stacked back panel connectors (black)

― Eight front panel ports implemented through four internal headers

• Two SATA 6.0 Gb/s interfaces through Intel P67 Express Chipset with Intel

Rapid Storage Technology RAID support (blue)

• Four Serial ATA (SATA) 3.0 Gb/s interfaces through Intel P67 Express Chipset

with Intel Rapid Storage Technology RAID support:

― Two internal SATA ports (black)

― One internal eSATA port (red)

― One back panel eSATA port (red)

• Two IEEE 1394a ports:

― One port via a back panel connector

― One port via an internal header for front panel cabling

continued