DP67BG Technical Product Specification
11
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor
• Intel
®
Core™ i7, Intel
®
Core™ i5, and Intel
®
Core™ i3 processors with up to
95 W TDP in an LGA1155 socket:
― 1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot
is populated)
― Two DDR3 memory channels
Memory
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 +1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
• Support for XMP memory
Chipset
Intel
®
P67 Express Chipset consisting of the Intel
®
P67 Platform Controller
Hub (PCH)
Audio Intel
®
High Definition Audio subsystem using the Realtek* ALC892 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
• Two USB 3.0 ports are implemented with stacked back panel connectors
(blue)
• Fourteen USB 2.0 ports:
― Eight ports are implemented with stacked back panel connectors (black)
― Six front panel ports implemented through three internal headers
• Two Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel P67 Express
Chipset with Intel
®
Rapid Storage Technology RAID support (blue)
• Four internal SATA 3.0 Gb/s interfaces through the Intel P67 Express Chipset
with Intel Rapid Storage Technology RAID support (black)
• One back panel eSATA port (red)
• Two IEEE 1394a ports:
― One port via a back panel connector
― One port via a front-panel header (blue)
Wireless Module
• Separate module that provides both Bluetooth* and WiFi included with the
desktop board (optional)
BIOS
• Intel
®
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and SMBIOS
continued