Intel® Desktop Board DP55WB Technical Product Specification September 2009 Order Number: E70716-001US The Intel® Desktop Board DP55WB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DP55WB Specification Update.
Revision History Revision -001 Revision History Date ® First release of the Intel Desktop Board DP55WB Technical Product Specification September 2009 This product specification applies to only the standard Intel® Desktop Board DP55WB with BIOS identifier WBIBX10J.86A. Changes to this specification will be published in the Intel Desktop Board DP55WB Specification Update before being incorporated into a revision of this document.
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DP55WB. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DP55WB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Intel Desktop Board DP55WB Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowe
Contents 1 Product Description 1.1 Overview.......................................................................................... 9 1.1.1 Feature Summary .................................................................. 9 1.1.2 Board Layout ....................................................................... 11 1.1.3 Block Diagram ..................................................................... 13 1.2 Legacy Considerations......................................................................
Intel Desktop Board DP55WB Technical Product Specification 2.5 Electrical Considerations ................................................................... 2.5.1 Power Supply Considerations ................................................. 2.5.2 Fan Header Current Capability................................................ 2.5.3 Add-in Board Considerations .................................................. 2.6 Thermal Considerations .................................................................... 2.
Contents Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Major Board Components.................................................................. Block Diagram ................................................................................ Memory Channel and DIMM Configuration ........................................... Back Panel Audio Connectors ............................................................ LAN Connector LED Locations ............................................................
Intel Desktop Board DP55WB Technical Product Specification 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. viii Thermal Considerations for Components ............................................. Environmental Specifications............................................................. BIOS Setup Program Menu Bar.......................................................... BIOS Setup Program Function Keys....................................................
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Processor • Intel® Core™ i7 and Core i5 processors in an LGA1156 socket ― One PCI Express* 2.
Intel Desktop Board DP55WB Technical Product Specification Table 1. Feature Summary (continued) Expansion Capabilities • One PCI Express 2.0 x16 bus add-in card connector Hardware Monitor Subsystem • Hardware monitoring and fan control ASIC Heceta 6P • Two PCI Express 2.
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DP55WB. Figure 1.
Intel Desktop Board DP55WB Technical Product Specification Table 2 lists the components identified in Figure 1. Table 2.
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2. Block Diagram 1.
Intel Desktop Board DP55WB Technical Product Specification 1.3 1.4 Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board DP55WB http://www.intel.com/products/motherboard/DP55WB/index.htm Desktop Board Support http://support.intel.com/support/motherboards/desktop Available configurations for the Intel Desktop Board DP55WB http://www.intel.com/products/motherboard/DP55WB/index.htm Supported processors http://processormatch.intel.
Product Description 1.5 System Memory The board has four DIMM sockets and supports the following memory features: • • • • • • • • • 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR3 SDRAM DIMMs. Support for 1.
Intel Desktop Board DP55WB Technical Product Specification 1.5.1 Memory Configurations The Intel Core i7 and Core i5 processors in the LGA1156 socket support the following types of memory organization: • • 16 Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.
Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE The Intel P55 Express Chipset requires memory to be populated in the Channel A, DIMM 0 socket. For best memory performance always install memory into the blue DIMM memory sockets if only installing two DIMMs in your configuration.
Intel Desktop Board DP55WB Technical Product Specification Intel® P55 Express Chipset 1.6 Intel P55 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, PCIe interfaces. The Intel P55 Express Chipset is a centralized controller for the board’s I/O paths. For information about Refer to The Intel P55 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2 1.6.
Product Description 1.6.2 SATA Interfaces The board provides six internal SATA connectors through the Intel P55 Express Chipset, which support one device per connector. The Intel P55 Express Chipset provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port. One device can be installed on each port for a maximum of six SATA devices.
Intel Desktop Board DP55WB Technical Product Specification 1.7 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
Product Description 1.8.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.3, page 14 1.8.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following: • • 1.8.
Intel Desktop Board DP55WB Technical Product Specification NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. For information about Refer to The locations of the front panel audio header and S/PDIF audio header Figure 10, page 39 The signal names of the front panel audio header and S/PDIF header Section 2.2.2.
Product Description 1.9.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com 1.9.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 5.
Intel Desktop Board DP55WB Technical Product Specification 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • • • Fan monitoring and control Thermal and voltage monitoring Chassis intrusion detection 1.10.
Product Description 1.10.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Rear chassis fan header B Processor fan header C Thermal diode, located on the processor die D Hardware Monitoring ASIC E Front chassis fan header F Remote thermal diode Figure 6.
Intel Desktop Board DP55WB Technical Product Specification 1.11 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Power Management Event signal (PME#) wake-up support ⎯ PCI Express WAKE# signal support 1.11.
Product Description 1.11.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Intel Desktop Board DP55WB Technical Product Specification 1.11.1.2 Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8.
Product Description 1.11.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.
Intel Desktop Board DP55WB Technical Product Specification 1.11.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network.
Product Description 1.11.2.5 Wake from USB USB bus activity wakes the computer from ACPI S1 or S3 states. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.11.2.6 PME# Signal Wake-up Support When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS). 1.11.2.
Intel Desktop Board DP55WB Technical Product Specification 1.11.2.8 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board.
Product Description 1.11.3 ENERGY STAR*, E-Standby, and ErP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. This Desktop Board meets the ENERGY STAR Program for Computers: Version 5.0 Category D requirements. For information about Refer to ENERGY STAR requirements and recommended configurations http://www.intel.
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2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel Desktop Board DP55WB Technical Product Specification Figure 8.
Technical Reference 2.1.2 Memory Map Table 9 lists the system memory map. Table 9. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used.
Intel Desktop Board DP55WB Technical Product Specification 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors for the board. Item Description A B C D E F G H USB ports IEEE 1394a connector USB ports LAN USB ports Line in Line out Mic in Figure 9. Back Panel Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
Technical Reference 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10.
Intel Desktop Board DP55WB Technical Product Specification Table 10 lists the component-side connectors and headers identified in Figure 10. Table 10.
Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. IEEE 1394a Header Pin Signal Name Pin Signal Name 1 Data A (positive) 2 Data A (negative) 3 Ground 4 Ground 5 Data B (positive) 6 Data B (negative) 7 +12 V DC 8 +12 V DC 9 Key (no pin) 10 Ground Table 12.
Intel Desktop Board DP55WB Technical Product Specification Table 29. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support) Pin Signal Name Pin Signal Name 1 +5 V DC 2 +5 V DC 3 D- 4 D- 5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 LED# Table 14. SATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 15.
Technical Reference 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • • PCI Express 2.0 x16: one PCI Express 2.0 x16 connector supporting simultaneous transfer speeds up to 8 GB/s of peak bandwidth per direction and up to 16 GB/s concurrent bandwidth. PCI Express 2.0 x1: two PCI Express 2.0 x1 connectors. The x1 interface supports simultaneous transfer speeds up to 2.5 Gb/s of peak bandwidth per direction and up to 5.0 Gb/s concurrent bandwidth.
Intel Desktop Board DP55WB Technical Product Specification Table 19. Main Power Connector Pin Signal Name Pin Signal Name 1 +3.3 V 13 +3.3 V 2 +3.
Technical Reference 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 20 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 20.
Intel Desktop Board DP55WB Technical Product Specification 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 21 shows the possible states for a one-color LED. Table 22 shows the possible states for a two-color LED. Table 21.
Technical Reference 2.2.2.5 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. NOTE • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram for Front Panel USB Headers Figure 13.
Intel Desktop Board DP55WB Technical Product Specification 2.2.2.6 Front Panel IEEE 1394a Header Figure 14 is a connection diagram for the IEEE 1394a header. NOTE • • The +12 V DC power on the IEEE 1394a header is fused. The IEEE 1394a header provides one IEEE 1394a port. Figure 14.
Technical Reference 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 15 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 23 describes the jumper settings for the three modes: normal, configure, and recovery.
Intel Desktop Board DP55WB Technical Product Specification Table 23. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings.
Technical Reference 2.4 2.4.1 Mechanical Considerations Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 16.
Intel Desktop Board DP55WB Technical Product Specification 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 25 lists the current capability of the fan headers. Table 25. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 2.0 A Front chassis fan 2.0 A Rear chassis fan 2.0 A 2.5.
Intel Desktop Board DP55WB Technical Product Specification CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Technical Reference Table 26 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 26.
Intel Desktop Board DP55WB Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 119,790 hours. 2.
3 Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as WBIBX10J.86A.
Intel Desktop Board DP55WB Technical Product Specification Table 28 lists the BIOS Setup program menu features. Table 28.
Overview of BIOS Features 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components.
Intel Desktop Board DP55WB Technical Product Specification To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions. 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment.
Overview of BIOS Features 3.6.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. For information about Refer to Intel® Integrator Toolkit http://developer.intel.
Intel Desktop Board DP55WB Technical Product Specification 3.8 Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. If enabled, the last default boot device is the network. 3.8.
Overview of BIOS Features 3.9 Adjusting Boot Speed These factors affect system boot speed: • • Selecting and configuring peripherals properly Optimized BIOS boot parameters 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • • • • Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds that minimizes hard drive startup delays. Select a CD-ROM drive with a fast initialization rate.
Intel Desktop Board DP55WB Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
Overview of BIOS Features 3.11 BIOS Performance Features The BIOS includes the following options to provide custom performance enhancements when using Intel Core i7 and Intel Core i5 processors in an LGA1156 socket.
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4 Error Messages and Beep Codes 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. 4.2 For information about Refer to The location of the onboard speaker Figure 1, page 11 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 33). Table 33. BIOS Beep Codes Type Pattern F2 Setup/F10 Boot Menu One 0.
Intel Desktop Board DP55WB Technical Product Specification 4.3 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 34). Table 34. Front-panel Power LED Blink Codes Type Pattern Note F2 Setup/F10 Boot Menu None Prompt 4.4 BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds.
Error Messages and Beep Codes 4.5 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
Intel Desktop Board DP55WB Technical Product Specification Table 37.
Error Messages and Beep Codes Table 37.
Intel Desktop Board DP55WB Technical Product Specification Table 37.
Error Messages and Beep Codes Table 38.
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5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board DP55WB: • • • • • 5.1.
Intel Desktop Board DP55WB Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DP55WB is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
Regulatory Compliance and Battery Disposal Information Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a 2006/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar. 5.1.
Intel Desktop Board DP55WB Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
Intel Desktop Board DP55WB Technical Product Specification Table 40. Lead-Free Board Markings Description Mark nd Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm).
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Intel Desktop Board DP55WB complies with the EMC regulations stated in Table 41 when correctly installed in a compatible host system. Table 41. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio Frequency Devices. (USA) ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus.
Intel Desktop Board DP55WB Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Intel Desktop Board DP55WB has the product certification markings shown in Table 42: Table 42.
Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Intel Desktop Board DP55WB Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
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