Intel Desktop Board DP45SG Technical Product Specification

Technical Reference
57
For information about Refer to
Processor datasheets and specification updates Section 1.3, page 14
Intel P45 Express chipset datasheets, specification updates,
and design guides
http://www.intel.com/pro
ducts/chipsets/index.htm
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements. The MTBF
data is calculated from predicted data at 55 ºC.
The MTBF for this board will be provided in a Motherboard Specification Update (MSU)
when available.
2.8 Environmental
Table 30 lists the environmental specifications for the board.
Table 30. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
-20 °C to +70 °C
Operating
0 °C to +55 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz