Technical Product Specification

13
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Mini ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
• 3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
®
HD Graphics)
― External graphics interface controller
Memory
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
rd
generation Intel Core
processor family processors
Chipset
Intel
®
H77 Express Chipset consisting of the Intel
®
H77 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel HD Graphics:
― High Definition Multimedia Interface* (HDMI*) v1.4a
― DVI-I v1.0
― DisplayPort* v1.1a
• Support for a PCI Express* 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
rd
generation Intel Core
processor family processors
Audio
• 8-channel (7.1 + 2) Intel
®
High Definition (Intel
®
HD) Audio via the Realtek*
ALC898 audio codec including:
― Front panel audio header with support for Intel HD Audio and AC ’97 Audio
― Five analog audio jacks on the back panel
― Onboard S/PDIF out header and back panel optical S/PDIF out connector
• 8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface*
(HDMI*)
continued