Technical Product Specification

11
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
ATX (9.60 inches by 11.60 inches [243.84 millimeters by 294.64 millimeters])
Processor
Intel
®
Core™ i7, Intel
®
Corei5, and Intel
®
Corei3 processors with up to
95W TDP in an LGA1155 socket
One PCI Express* 2.0 x16 graphics interface
Integrated memory controller with dual channel DDR3 memory support
Integrated graphics processing (processors with Intel
®
Graphics
Technology)
External graphics interface controller
Memory
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
Support for 1 Gb, 2 Gb, and 4 Gb memory technology
Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
Support for non-ECC memory
Support for 1.35 V low voltage JEDEC memory
Chipset
Intel
®
H67 Express Chipset consisting of the Intel
®
H67 Express Platform
Controller Hub (PCH)
Graphics
Integrated graphics support for processors with Intel Graphics Technology:
High Definition Multimedia Interface* (HDMI*)
DVI-I
Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio 10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio
codec
continued