DH67CF Technical Product Specification

11
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
• Intel
®
Core™ i7, Intel
®
Core™ i5, and Intel Core™ i3 processors with up to
65W TDP in an LGA1155 socket
― One PCI Express* 2.0 x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
®
Graphics
Technology)
Memory
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Chipset
Intel
®
H67 Express Chipset consisting of the Intel
®
H67 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel Graphics Technology:
― High Definition Multimedia Interface* (HDMI*)
― DVI-I
― DisplayPort*
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio
• 10-channel (8+2) Intel High Definition audio via the Realtek* ALC892 audio
codec
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface and the
DisplayPort interface
continued