Technical Product Specification

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

MicroATX (8.85 inches by 7.45 inches [225 millimeters by 190 millimeters])

Processor

• 3

generation Intel

Core processor family and 2

generation Intel

Core

processor family processors with up to 95 W TDP in an LGA1155 socket

― PCI Express* 3.0 x16 graphics interface

― Integrated graphics processing (processors with Intel

Graphics

Technology)

― External graphics interface controller

― Integrated memory controller with dual channel DDR3 memory support

Chipset

Intel

H61 Express Chipset consisting of the Intel

H61 Platform Controller

Hub (PCH)

Memory

• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 16 GB of system memory with two DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

Graphics

• Integrated graphics support for processors with Intel

Graphics Technology

― VGA

― DVI-D

• Support for PCI Express 3.0 x16 add-in graphics cards

Note: PCI Express 3.0 is only supported by 3

generation Intel Core

processor family processors

Audio

• Intel

High Definition Audio:

― Realtek* ALC662VC audio codec

― Front panel audio header for Intel HD Audio and AC ’97 Audio support

continued