Technical Product Specification
Table Of Contents
- Intel® Desktop Board DH61BE Technical Product Specification
- Revision History
- Preface
- Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Legacy Considerations
- 1.3 Online Support
- 1.4 Processor
- 1.5 Intel® H61 Express Chipset
- 1.6 System Memory
- 1.7 Graphics Subsystem
- 1.8 USB
- 1.9 SATA Interfaces
- 1.10 Legacy I/O Controller
- 1.11 Audio Subsystem
- 1.12 LAN Subsystem
- 1.13 Real-Time Clock Subsystem
- 1.14 Thermal Monitoring
- 1.15 Platform Management and Security
- 1.16 Power Management
- 2 Technical Reference
- 3 Overview of BIOS Features
- 4 Error Messages and Beep Codes
- 5 Regulatory Compliance and Battery Disposal Information
Technical Reference
59
Figure 16 shows the locations of the localized high temperature zones.
Item
Description
A Processor voltage regulator area
B
Processor
C
Intel H61 Express Chipset
Figure 16. Localized High Temperature Zones
Table 31 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 31. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Express Chipset 111
o
C (under bias)
For information about
Refer to
Processor datasheets and specification updates Section 1.3, page 16