Technical Product Specification
Table Of Contents
- Intel® Desktop Board DH61BE Technical Product Specification
- Revision History
- Preface
- Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Legacy Considerations
- 1.3 Online Support
- 1.4 Processor
- 1.5 Intel® H61 Express Chipset
- 1.6 System Memory
- 1.7 Graphics Subsystem
- 1.8 USB
- 1.9 SATA Interfaces
- 1.10 Legacy I/O Controller
- 1.11 Audio Subsystem
- 1.12 LAN Subsystem
- 1.13 Real-Time Clock Subsystem
- 1.14 Thermal Monitoring
- 1.15 Platform Management and Security
- 1.16 Power Management
- 2 Technical Reference
- 3 Overview of BIOS Features
- 4 Error Messages and Beep Codes
- 5 Regulatory Compliance and Battery Disposal Information
Product Description
25
1.11.2.1 Analog Audio Connectors
The available configurable back panel audio connectors are shown in Figure 4.
Item
Description
A Rear surround
B Center channel and LFE
(subwoofer)
C S/PDIF out (optical)
D Line in
E Mic in/side surround
F Line out/front speakers
Figure 4. Back Panel Audio Connector Options
The back panel audio connectors are configurable through the audio device drivers.
For information about
Refer to
The back panel audio connectors
Section 2.2.1, page 42
The front panel headphone output is supported using a separate audio channel pair
allowing multi-streaming audio configurations such as simultaneous 5.1 surround
playback and stereo audio conferencing (through back panel speakers and a front
panel headset, respectively).
1.11.2.2 S/PDIF Header
The S/PDIF header allows connections to coaxial or optical dongles for digital audio
output.
1.11.2.3 Internal Mono Speaker Header
The internal mono speaker header allows connection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).