Technical Product Specification

Technical Reference
65
2.8 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Issue 2; Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate
repair rates and spare parts requirements. The MTBF for the Intel Desktop Board
DH61AGL is 61,767 hours.
2.9 Environmental
Table 35 lists the environmental specifications for the board.
Table 35. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
-40
°
C to +60
°
C
(Note)
Operating
0 °C to +60 °C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Dimension of package (L x W x H)
465 x 220 x 230 mm
Package weight 12.54 pounds
Drop height 36 inches
Drop sequence (total drops) 6 faces, 2 corners, 3 edges
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.