Intel Desktop Board DG965SS Technical Product Specification

Table Of Contents

Table 33 provides maximum case temperatures for the board components that are

sensitive to thermal changes. The operating temperature, current load, or operating

frequency could affect case temperatures. Maximum case temperatures are important

when considering proper airflow to cool the board.

Table 33. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel 82G965 GMCH 97

C (under bias)

Intel 82801HB ICH8 92

C (under bias)

For information about Refer to

Processor datasheets and specification updates Section 1.2, page 15

2.12 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and

subassembly random failure rates. The calculation is based on the Bellcore Reliability

Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF

prediction is used to estimate repair rates and spare parts requirements.

The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board

DG965SS MTBF is 123,443 hours.