Intel® Desktop Board DG33TL Technical Product Specification May 2007 Order Number: D95738-001US The Intel® Desktop Board DG33TL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG33TL Specification Update.
Revision History Revision -001 Revision History First release of the Specification. Intel® Date Desktop Board DG33TL Technical Product May 2007 This product specification applies to only the standard Intel® Desktop Board DG33TL with BIOS identifier DPP3510J.86A. Changes to this specification will be published in the Intel Desktop Board DG33TL Specification Update before being incorporated into a revision of this document. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DG33TL. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG33TL and its components to the vendors, system integrators, and other engineers and technicians who need this level of information.
Intel Desktop Board DG33TL Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value en
Contents 1 Product Description 1.1 Overview........................................................................................ 10 1.1.1 Feature Summary ................................................................ 10 1.1.2 Board Layout ....................................................................... 12 1.1.3 Block Diagram ..................................................................... 14 1.2 Legacy Considerations......................................................................
Intel Desktop Board DG33TL Technical Product Specification 2.3 Jumper Block .................................................................................. 53 2.4 Mechanical Considerations ................................................................ 54 2.4.1 Form Factor......................................................................... 54 2.5 Electrical Considerations ................................................................... 55 2.5.1 Power Supply Considerations ......................
Contents Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Major Board Components.................................................................. Block Diagram ................................................................................ Memory Channel and DIMM Configuration ........................................... Back Panel Audio Connector Options .................................................. LAN Connector LED Locations ..........................................................
Intel Desktop Board DG33TL Technical Product Specification 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. viii Thermal Considerations for Components ............................................. Desktop Board DG33TL Environmental Specifications............................ BIOS Setup Program Menu Bar.......................................................... BIOS Setup Program Function Keys....................................................
1 Product Description What This Chapter Contains 1.1 Overview........................................................................................ 10 1.2 Legacy Considerations...................................................................... 15 1.3 Online Support................................................................................ 15 1.4 Processor ....................................................................................... 15 1.5 System Memory .................................
Intel Desktop Board DG33TL Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG33TL. Table 1. Feature Summary Form Factor ATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.
Product Description Table 1. Feature Summary (continued) Instantly Available PC Technology • Support for PCI* Local Bus Specification Revision 2.3 • Support for PCI Express* Revision 1.
Intel Desktop Board DG33TL Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
Product Description Table 2.
Intel Desktop Board DG33TL Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2.
Product Description 1.2 Legacy Considerations This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following: • • • • 1.3 No parallel port No floppy drive connector No serial port on the back panel The serial port header is located near the memory sockets and may require a specialized chassis or cabling solution to use Online Support To find information about… Visit this World Wide Web site: Intel® Desktop Board DG33TL http://www.
Intel Desktop Board DG33TL Technical Product Specification 1.5 System Memory The board has four DIMM sockets and support the following memory features: • • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. • • • • • • • 8 GB maximum total system memory using DDR2 800 or DDR2 667 DIMMs; refer to Section 2.1.
Product Description 1.5.1 Memory Configurations The Intel 82G33 GMCH supports the following types of memory organization: • • • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal.
Intel Desktop Board DG33TL Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. NOTE The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels are black. Figure 3. Memory Channel and DIMM Configuration # INTEGRATOR’S NOTE Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the Intel® Management Engine.
Product Description 1.6 Intel® G33 Express Chipset The Intel G33 Express chipset consists of the following devices: • • Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect Intel 82801IR I/O Controller Hub (ICH9R) The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities.
Intel Desktop Board DG33TL Technical Product Specification • Display ⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ Dual independent display support ⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display connections 1.6.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through highly efficient memory utilization.
Product Description 1.6.1.5 Advanced Digital Display (ADD2/MEC) Card Support The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a 225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card.
Intel Desktop Board DG33TL Technical Product Specification 1.6.4 Serial ATA Interfaces The board provides five Serial ATA (SATA) connectors, which support one device per connector. The board also provides one red-colored external Serial ATA (eSATA) connector. 1.6.4.1 Serial ATA Support The DG33TL Desktop Board’s Serial ATA controller offers six independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port.
Product Description 1.7 Parallel IDE Controller The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • • • • • Programmed I/O (PIO): processor controls data transfer. 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec.
Intel Desktop Board DG33TL Technical Product Specification 1.9 Legacy I/O Controller The I/O controller provides the following features: • • • • • • Consumer Infrared (CIR) headers One serial port header Serial IRQ interface compatible with serialized IRQ support for PCI systems PS/2-style mouse and keyboard interfaces Intelligent power management, including a programmable wake-up event interface PCI power management support The BIOS Setup program provides configuration options for the I/O controller.
Product Description 1.10 Audio Subsystem The onboard audio subsystem consists of the following: • • • • Intel 82801IR (ICH9R) IDT STAC9271D audio codec Back panel audio connectors Component-side audio headers: ⎯ Intel® High Definition Audio front panel header ⎯ HD audio link header The audio subsystem supports the following features: • • • • Dolby Home Theater support A signal-to-noise (S/N) ratio of 95 dB Independent multi-streaming 7.
Intel Desktop Board DG33TL Technical Product Specification 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15 1.10.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel.
Product Description 1.
Intel Desktop Board DG33TL Technical Product Specification 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 5.
Product Description 1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • • • Fan monitoring and control Thermal and voltage monitoring Chassis intrusion detection 1.12.
Intel Desktop Board DG33TL Technical Product Specification 1.12.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Rear chassis fan B Thermal diode, located on processor die C Thermal diode, located on the GMCH die D Remote thermal sensor E Processor fan F Thermal diode, located on the ICH9R die G Front chassis fan Figure 6. Thermal Sensors and Fan Headers NOTE The minimum thermal reporting threshold for the GMCH is 66°C.
Product Description 1.13 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Power Management Event signal (PME#) wake-up support ⎯ Wake from Consumer IR 1.13.
Intel Desktop Board DG33TL Technical Product Specification 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off.
Product Description 1.13.1.2 ENERGY STAR* In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. Currently Intel Desktop Boards meet the new requirements. For information about Refer to ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar 1.13.1.
Intel Desktop Board DG33TL Technical Product Specification 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
Product Description 1.13.2.2 Fan Headers The function/operation of the fan headers is as follows: • • • • The fans are on when the board is in the S0 state. The fans are off when the board is off or in the S3, S4, or S5 state. The CPU fan header is wired to a fan tachometer input and the Front and Rear fan headers share the tachometer input of the hardware monitoring and fan control device.
Intel Desktop Board DG33TL Technical Product Specification 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state.
Product Description 1.13.2.5 Wake from USB USB bus activity wakes the computer from ACPI S1 and S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the OS. 1.13.2.6 PME# Signal Wake-up Support When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS). 1.13.2.
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2 Technical Reference What This Chapter Contains 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.1 2.1.1 Memory Map................................................................................... 39 Connectors and Headers................................................................... 42 Jumper Block .................................................................................. 53 Mechanical Considerations ................................................................ 54 Electrical Considerations ........
Intel Desktop Board DG33TL Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
Technical Reference Table 10 lists the system memory map. Table 10. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used.
Intel Desktop Board DG33TL Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB, with support for 1394. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis.
Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors. Item Description A VGA output B DVI-D output C IEEE-1394a D USB ports [2] E USB ports [2] F LAN G USB ports [2] H Surround left/right channel audio out I Center channel and LFE (subwoofer) audio out J Audio line in K S/PDIF Digital audio out (optical) L Mic in M Audio line out Figure 9.
Intel Desktop Board DG33TL Technical Product Specification 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10.
Technical Reference Table 11 lists the component-side connectors and headers identified in Figure 10. Table 11.
Intel Desktop Board DG33TL Technical Product Specification 2.2.2.1 Signal Tables for the Connectors and Headers Table 12. HD Audio Link Header Pin Signal Name Pin Signal Name 1 BCLK 2 Ground 3 RST# 4 3.3 VCC 5 SYNC 6 Ground 7 SDO 8 3.3 VCC 9 SDI0 10 +12 V 11 SDI1 12 Key (no pin) 13 Aud RSVD 14 3.3 V STBY 15 Aud RSVD 16 Ground Table 13.
Technical Reference Table 16. Chassis Intrusion Header Pin Signal Name 1 Intruder 2 Ground Table 17. Front and Rear Chassis (3-Pin) Fan Headers Pin Signal Name 1 Control 2 +12 V 3 Tach Table 18. Processor (4-Pin) Fan Header Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Table 20. Back Panel CIR Emitter (Output) Header Pin Signal Name 1 Emitter out 1 2 Emitter out 2 3 Ground 4 Key (no pin) 5 Jack detect 1 6 Jack detect 2 Table 21.
Intel Desktop Board DG33TL Technical Product Specification 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • • PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth PCI Express x1: two PCI Express x1 connectors.
Technical Reference 2.2.2.4 Power Supply Connectors The board has the following power supply connectors: • • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected.
Intel Desktop Board DG33TL Technical Product Specification 2.2.2.5 Front Panel Header This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 22.
Technical Reference 2.2.2.5.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • • A Serial ATA hard drive connected to an onboard Serial ATA connector A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector 2.2.2.5.
Intel Desktop Board DG33TL Technical Product Specification 2.2.2.6 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. # INTEGRATOR’S NOTES • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12. Connection Diagram for Front Panel USB Headers 2.2.2.7 Front Panel IEEE 1394a Header Figure 13 is a connection diagram for the IEEE 1394a header.
Technical Reference 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 14 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 25 lists the jumper settings for the three modes: normal, configure, and recovery.
Intel Desktop Board DG33TL Technical Product Specification 2.4 2.4.1 Mechanical Considerations Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 15.
Technical Reference 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
Intel Desktop Board DG33TL Technical Product Specification 2.5.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots and the PCI Express x16 connector filled) must not exceed 8 A. 2.6 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement.
Technical Reference Figure 16 shows the locations of the localized high temperature zones. Item Description A Processor voltage regulator area B Processor C Intel 82G33 GMCH D Intel 82801IR (ICH9R) Figure 16. Localized High Temperature Zones Table 28 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures.
Intel Desktop Board DG33TL Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG33TL MTBF is 218,279 hours. 2.
3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction ................................................................................... 3.2 BIOS Flash Memory Organization ....................................................... 3.3 Resource Configuration .................................................................... 3.4 System Management BIOS (SMBIOS)................................................. 3.5 Legacy USB Support ...........................................................
Intel Desktop Board DG33TL Technical Product Specification Table 30 lists the BIOS Setup program menu features. Table 30.
Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the capabilities of each drive and configures them to optimize capacity and performance.
Intel Desktop Board DG33TL Technical Product Specification 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3.
Overview of BIOS Features 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.
Intel Desktop Board DG33TL Technical Product Specification 3.7 BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 32 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 32.
Overview of BIOS Features 3.8 Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. If enabled, the last default boot device is the network. 3.8.1 CD-ROM Boot Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification.
Intel Desktop Board DG33TL Technical Product Specification 3.9 Adjusting Boot Speed These factors affect system boot speed: • • Selecting and configuring peripherals properly Optimized BIOS boot parameters 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • • • • Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds, that minimize hard drive startup delays.
Overview of BIOS Features 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
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4 Error Messages and Beep Codes What This Chapter Contains 4.1 4.2 4.3 4.4 4.1 Speaker ......................................................................................... 69 BIOS Beep Codes ............................................................................ 69 BIOS Error Messages ....................................................................... 69 Port 80h POST Codes .......................................................................
Intel Desktop Board DG33TL Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
Error Messages and Beep Codes Table 38.
Intel Desktop Board DG33TL Technical Product Specification Table 38.
Error Messages and Beep Codes Table 38.
Intel Desktop Board DG33TL Technical Product Specification Table 39.
5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance..................................................................... 75 5.2 Battery Disposal Information............................................................. 85 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG33TL: • • • • • 5.1.
Intel Desktop Board DG33TL Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DG33TL is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
Regulatory Compliance and Battery Disposal Information Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC u 2006/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC & 2006/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC & 2006/95/EC.
Intel Desktop Board DG33TL Technical Product Specification 5.1.3 Product Ecology Statements The following information is provided to address worldwide product ecology concerns and regulations. 5.1.3.1 Disposal Considerations This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly. 5.1.3.
Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées. Visitez la page Web http://www.intel.
Intel Desktop Board DG33TL Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.
Regulatory Compliance and Battery Disposal Information Table 41 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it appears on the board and accompanying collateral. Table 41.
Intel Desktop Board DG33TL Technical Product Specification 5.1.4 EMC Regulations Desktop Board DG33TL complies with the EMC regulations stated in Table 42 when correctly installed in a compatible host system. Table 42. EMC Regulations 82 Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA) ICES-003 Issue 4 (Class B) Interference-Causing Equipment Standard, Digital Apparatus.
Regulatory Compliance and Battery Disposal Information Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
Intel Desktop Board DG33TL Technical Product Specification 5.1.5 Product Certification Markings (Board Level) Desktop Board DG33TL has the product certification markings shown in Table 43. Table 43. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and DG33TL model designation. CE mark.
Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Intel Desktop Board DG33TL Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
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