Intel® Desktop Board DG33BU Technical Product Specification May 2007 Order Number: D88104-001US The Intel® Desktop Board DG33BU may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG33BU Specification Update.
Revision History Revision Revision History Date -001 First release of the Intel® Desktop Board DG33BU Technical Product May 2007 Specification This product specification applies to only the standard Intel® Desktop Board DG33BU with BIOS identifier DPP3510A.86A. Changes to this specification will be published in the Intel Desktop Board DG33BU Specification Update before being incorporated into a revision of this document. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board DG33BU. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG33BU and its components to the vendors, system integrators, and other engineers and technicians who need this level of information.
Intel Desktop Board DG33BU Technical Product Specification Other Common Notation iv # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value e
Contents 1 Product Description 1.1 Overview........................................................................................ 10 1.1.1 Feature Summary ................................................................ 10 1.1.2 Board Layout ....................................................................... 12 1.1.3 Block Diagram ..................................................................... 14 1.2 Legacy Considerations......................................................................
Intel Desktop Board DG33BU Technical Product Specification 2 Technical Reference 2.1 Memory Map................................................................................... 37 2.1.1 Addressable Memory............................................................. 37 2.2 Connectors and Headers................................................................... 40 2.2.1 Back Panel Connectors .......................................................... 41 2.2.2 Component-side Connectors and Headers .........
Contents 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.2 Battery Safety Standards.................................................................. European Union Declaration of Conformity Statement ................ Product Ecology Statements................................................... EMC Regulations .................................................................. Product Certification Markings (Board Level)............................. Disposal Information.....................................................
Intel Desktop Board DG33BU Technical Product Specification 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. viii States for a One-Color Power LED ...................................................... States for a Two-Color Power LED...................................................... Auxiliary Front Panel Power LED Header.............................................. BIOS Setup Configuration Jumper Settings..........................................
1 Product Description What This Chapter Contains 1.1 Overview........................................................................................ 10 1.2 Legacy Considerations...................................................................... 15 1.3 Online Support................................................................................ 15 1.4 Processor ....................................................................................... 15 1.5 System Memory .................................
Intel Desktop Board DG33BU Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG33BU. Table 1. Feature Summary Form Factor microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.
Product Description Table 1.
Intel Desktop Board DG33BU Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
Product Description Table 2.
Intel Desktop Board DG33BU Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2.
Product Description 1.2 Legacy Considerations This board differs from other Intel® Desktop Board products, with specific changes including (but not limited to) the following: • • • • 1.
Intel Desktop Board DG33BU Technical Product Specification # INTEGRATOR’S NOTE Use only ATX12V-compliant power supplies. For information about Refer to Power supply connectors Section 2.2.2.4, page 46 1.5 System Memory The board has four DIMM sockets and supports the following memory features: • • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported.
Product Description 1.5.1 Memory Configurations The Intel 82G33 GMCH supports the following types of memory organization: • • • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal.
Intel Desktop Board DG33BU Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. NOTE The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels are black. Figure 3. Memory Channel Configuration and DIMM Configuration # INTEGRATOR’S NOTE Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the Intel Management Engine in ICH9DH.
Product Description Intel® G33 Express Chipset 1.6 The Intel G33 Express chipset consists of the following devices: • • Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect Intel 82801IH I/O Controller Hub (ICH9DH) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities.
Intel Desktop Board DG33BU Technical Product Specification • Video ⎯ Software DVD at 30 fps full screen • ⎯ DVMT support up to 256 MB Display ⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ Dual independent display support ⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display connections 1.6.1.
Product Description • HDMI support (when used with the HD Audio Link) Intel® Viiv™ Processor Technology 1.6.2 This Intel desktop board supports Intel Viiv processor technology. To be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for Intel Viiv processor technology branding as well as all the features supported by Intel Viiv processor technology, refer to http://www.intel.com/products/viiv/index.
Intel Desktop Board DG33BU Technical Product Specification NOTE Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/ For information about Refer to The location of the Serial ATA connectors Figure 10, page 42 1.7 Parallel IDE Controller The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface.
Product Description 1.8 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
Intel Desktop Board DG33BU Technical Product Specification 1.9.3 PS/2 Keyboard and Mouse Interface The PS/2 keyboard and mouse connectors are located on the back panel. NOTE The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected. For information about Refer to The location of the keyboard and mouse connectors Figure 9, page 41 1.
Product Description 1.10.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15 1.10.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel.
Intel Desktop Board DG33BU Technical Product Specification 1.
Product Description 1.11.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15 1.11.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 5.
Intel Desktop Board DG33BU Technical Product Specification 1.12 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • • • Fan monitoring and control Thermal and voltage monitoring Chassis intrusion detection 1.12.
Product Description 1.12.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Thermal diode, located on processor die B Thermal diode, located on the GMCH die C Thermal diode, located on the ICH9DH die D Front chassis fan E Processor fan F Rear chassis fan Figure 6. Thermal Sensors and Fan Headers NOTE The minimum thermal reporting threshold for the GMCH is 66°C.
Intel Desktop Board DG33BU Technical Product Specification 1.13 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support 1.13.
Product Description 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Intel Desktop Board DG33BU Technical Product Specification 1.13.1.2 ENERGY STAR* In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. Currently Intel Desktop Boards meet the new requirements. For information about Refer to ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar 1.13.1.
Product Description 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
Intel Desktop Board DG33BU Technical Product Specification 1.13.2.2 Fan Headers The function/operation of the fan headers is as follows: • • • • The fans are on when the board is in the S0 state. The fans are off when the board is off or in the S3, S4, or S5 state. The processor fan header is wired to a fan tachometer input and the Front and Rear fan headers share the tachometer input of the hardware monitoring and fan control device.
Product Description 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state.
Intel Desktop Board DG33BU Technical Product Specification 1.13.2.9 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board.
2 Technical Reference What This Chapter Contains 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.1 2.1.1 Memory Map................................................................................... 37 Connectors and Headers................................................................... 40 Jumper Block .................................................................................. 50 Mechanical Considerations ................................................................ 51 Electrical Considerations ........
Intel Desktop Board DG33BU Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
Technical Reference Table 9 lists the system memory map. Table 9. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used.
Intel Desktop Board DG33BU Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis.
Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the locations of the back panel connectors. Item Description A PS/2 mouse port B PS/2 keyboard port C VGA port D IEEE 1394a port E USB ports [2] F USB ports [2] G LAN H USB ports [2] I Line in J Mic in K Line out Figure 9.
Intel Desktop Board DG33BU Technical Product Specification 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10.
Technical Reference Table 10 lists the component-side connectors and headers identified in Figure 10. Table 10.
Intel Desktop Board DG33BU Technical Product Specification 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Serial ATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 12. Chassis Intrusion Header Pin Signal Name 1 Intruder 2 Ground Table 13. Serial Port Header Pin Signal Name Pin Signal Name 1 DCD 2 RXD# 3 TXD# 4 DTR 5 Ground 6 DSR 7 RTS 8 CTS 9 RI 10 Key (no pin) Table 14.
Technical Reference Table 16. Front Panel Audio Header Pin Signal Name Pin 1 [Port 1] Left channel 2 Ground 3 [Port 1] Right channel 4 PRESENCE# (Dongle present) 5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN 2.2.2.
Intel Desktop Board DG33BU Technical Product Specification 2.2.2.4 Power Supply Connectors The board has the following power supply connectors: • • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables.
Technical Reference 2.2.2.5 Front Panel Header This section describes the functions of the front panel header. Table 20 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 20.
Intel Desktop Board DG33BU Technical Product Specification 2.2.2.5.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.5.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 21 shows the possible states for a one-color LED. Table 22 shows the possible states for a two-color LED. Table 21.
Technical Reference 2.2.2.7 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. # INTEGRATOR’S NOTES • • The +5 V DC power on the front panel USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 12.
Intel Desktop Board DG33BU Technical Product Specification 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 24 lists the jumper settings for the three modes: normal, configure, and recovery.
Technical Reference 2.4 2.4.1 Mechanical Considerations Form Factor The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 14 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 14.
Intel Desktop Board DG33BU Technical Product Specification 2.5 Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 26 lists the current capability of the fan headers. Table 26. Fan Header Current Capability Fan Header Maximum Available Current Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A 2.5.
Intel Desktop Board DG33BU Technical Product Specification CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 15) can reach a temperature of up to 95 oC in an open chassis. Figure 15 shows the locations of the localized high temperature zones.
Technical Reference Table 27 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 27. Thermal Considerations for Components 2.
Intel Desktop Board DG33BU Technical Product Specification 2.8 Environmental Table 28 lists the environmental specifications for the board. Table 28.
3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction ................................................................................... 3.2 BIOS Flash Memory Organization ....................................................... 3.3 Resource Configuration .................................................................... 3.4 System Management BIOS (SMBIOS)................................................. 3.5 Legacy USB Support ...........................................................
Intel Desktop Board DG33BU Technical Product Specification Table 29 lists the BIOS Setup program menu features. Table 29.
Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the capabilities of each drive and configures them to optimize capacity and performance.
Intel Desktop Board DG33BU Technical Product Specification 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3.
Overview of BIOS Features 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.
Intel Desktop Board DG33BU Technical Product Specification 3.6.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel® Integrator Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. For information about Refer to Intel Integrator Toolkit http://developer.intel.
Overview of BIOS Features 3.8 Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled. 3.8.1 CD-ROM Boot Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification.
Intel Desktop Board DG33BU Technical Product Specification 3.9 Adjusting Boot Speed These factors affect system boot speed: • • 3.9.1 Selecting and configuring peripherals properly Optimized BIOS boot parameters Peripheral Selection and Configuration The following techniques help improve system boot speed: • • • • 3.9.2 Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds, that minimize hard drive startup delays.
Overview of BIOS Features 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
Intel Desktop Board DG33BU Technical Product Specification 66
4 Error Messages and Beep Codes What This Chapter Contains 4.1 4.2 4.3 4.4 4.1 Speaker ......................................................................................... 67 BIOS Beep Codes ............................................................................ 67 BIOS Error Messages ....................................................................... 67 Port 80h POST Codes .......................................................................
Intel Desktop Board DG33BU Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
Error Messages and Beep Codes Table 37.
Intel Desktop Board DG33BU Technical Product Specification Table 37.
Error Messages and Beep Codes Table 37.
Intel Desktop Board DG33BU Technical Product Specification Table 38.
5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance..................................................................... 73 5.2 Battery Disposal Information............................................................. 81 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG33BU: • • • • • 5.1.
Intel Desktop Board DG33BU Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DG33BU is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
Regulatory Compliance and Battery Disposal Information Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC & 2006/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC a 2006/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in 2006/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC & 2006/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar. 5.1.
Intel Desktop Board DG33BU Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
Intel Desktop Board DG33BU Technical Product Specification Table 40 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it appears on the board and accompanying collateral. Table 40.
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board DG33BU complies with the EMC regulations stated in Table 41 when correctly installed in a compatible host system. Table 41. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA) ICES-003 Issue 4 (Class B) Interference-Causing Equipment Standard, Digital Apparatus.
Intel Desktop Board DG33BU Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Desktop Board DG33BU has the product certification markings shown in Table 42: Table 42. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark.
Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Intel Desktop Board DG33BU Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
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