Technical product specification
Table Of Contents
- Intel® NUC Board NUC5i5RYB and Intel® NUC Board NUC5i3RYB Technical Product Specification
- Revision History
- Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® High Definition (Intel® HD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 Mini High Definition Multimedia Interface* (Mini HDMI*)
- 1.5.1.4 Mini DisplayPort*
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the Mini HDMI and Mini DisplayPort Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Real-Time Clock Subsystem
- 1.9 Audio Subsystem
- 1.10 LAN Subsystem
- 1.11 Hardware Management Subsystem
- 1.12 Power Management
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Connectors and Headers (Bottom)
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Regulatory Compliance and Battery Disposal Information
Technical Reference
55
Table 22 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to
cool the board.
Table 22. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and processor
specification updates
To ensure functionality and reliability, the component is specified for proper operation when Case
Temperature is maintained at or below the maximum temperature listed in Table 23. This is a
requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as
the maximum sustainable power to be dissipated by the components). When the component is
dissipating less than TDP, the case temperature should be below the Maximum Case
Temperature. The surface temperature at the geometric center of the component corresponds to
Case Temperature.
It is important to note that the temperature measurement in the system BIOS is a value reported
by embedded thermal sensors in the components and does not directly correspond to the
Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is
Tcontrol.
Table 23. Tcontrol Values for Components
Component Tcontrol
Processor For processor case temperature, see processor datasheets and processor
specification updates
For information about
Refer to
Processor datasheets and specification updates Section 1.2, page 18