Technical product specification

11
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
• Soldered-down Intel
®
Atom
™
processor E3815 with up to ∼5 W TDP
― Integrated graphics
― Integrated memory controller
― Integrated PCH
Memory
•
Support for DDR3L 1066 MHz SO-DIMM
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 8 GB of system memory with one SO-DIMM using 4 Gb memory
technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
• One 4 GB Embedded MultiMediaCard (e·MMC) device in a Ball Grid Array (BGA) package
Graphics
• Integrated graphics support with Intel
®
Graphics Technology:
― Digital displays (High Definition Multimedia Interface* (HDMI*))
― Analog displays (VGA)
• Flat panel displays via the internal Embedded DisplayPort* (eDP) connector
Audio
•
Intel
®
High Definition Audio via the HDMI v1.4a interface
• Realtek ALC283 audio codec providing:
― High Definition Audio via a stereo microphone/headphone jack on the back panel
― Internal stereo speaker header
― Support for digital microphone (DMIC) via internal header
Peripheral Interfaces
•
USB ports:
― Two USB 2.0 back panel connectors
― Two front panel USB 2.0 ports are implemented through a dual-port internal header
― One front panel USB 2.0 port is implemented through a single-port internal header
― One USB 3.0 front panel connector
― One port is reserved for the PCI Express* Half-Mini Card
• SATA ports:
― One SATA 3.0 Gb/s port
Expansion Capabilities One PCI Express Half-Mini Card connector
BIOS
• Intel
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
System Management BIOS (SMBIOS)
continued