Intel® Desktop Board DB75EN Technical Product Specification July 2013 Part Number: G54940-005 The Intel Desktop Board DB75EN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DB75EN Specification Update.
Revision History Revision Revision History Date ® -001 First release of the Intel Desktop Board DB75EN Technical Product Specification April 2012 -002 Specification clarification June 2012 -003 Specification clarification October 2012 -004 Specification clarification May 2013 -005 Specification clarification July 2013 This product specification applies to only the standard Intel® Desktop Board with BIOS identifier ENB7510H.86A.
Board Identification Information Basic Desktop Board DB75EN Identification Information AA Revision BIOS Revision Notes G39650-300 ENB7510H.86A.0017 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2.
Intel Desktop Board DB75EN Technical Product Specification iv
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® Desktop Board DB75EN. Intended Audience The TPS is intended to provide detailed, technical information about Intel Desktop Board DB75EN and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
Intel Desktop Board DB75EN Technical Product Specification Other Common Notation vi # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value e
Contents Revision History Board Identification Information ..................................................................iii Specification Changes or Clarifications .........................................................iii Errata ......................................................................................................iii Preface Intended Audience..................................................................................... v What This Document Contains............................
Intel Desktop Board DB75EN Technical Product Specification 1.11.4 Intel® Anti-Theft Technology ................................................... 34 1.11.5 Intel® Management Engine (Intel® ME) Software and Drivers ...... 35 1.12 Power Management .......................................................................... 36 1.12.1 ACPI .................................................................................... 36 1.12.2 Hardware Support ..............................................................
Contents 3.10 Hard Disk Drive Password Security Feature .......................................... 72 3.11 BIOS Security Features ..................................................................... 73 3.12 BIOS Performance Features ............................................................... 74 4 Error Messages and Beep Codes 4.1 4.2 4.3 4.4 4.5 Speaker .......................................................................................... 75 BIOS Beep Codes ......................................
Intel Desktop Board DB75EN Technical Product Specification Tables 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 51. 41. 42. 43. 44. x Feature Summary ............................................................................. 13 Components Shown in Figure 1 .......................................................... 16 Supported Memory Configurations ..................................................
Contents 45. 46. 47. 48. 49. 50. Port 80h POST Code Ranges .............................................................. 77 Port 80h POST Codes ........................................................................ 78 Typical Port 80h POST Sequence ........................................................ 82 Safety Standards .............................................................................. 83 EMC Regulations ...............................................................................
Intel Desktop Board DB75EN Technical Product Specification xii
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Processor • 3rd generation Intel® Core processor family and 2nd generation Intel® Core processor family processors with up to 95 W TDP in an LGA1155 socket ― One PCI Express* 3.
Intel Desktop Board DB75EN Technical Product Specification Table 1. Feature Summary (continued) Peripheral Interfaces • Four USB 3.0 ports: ― Two USB 3.0 ports are implemented with stacked back panel connectors (blue) ― Two front panel USB 3.0 ports are implemented through one internal connector (blue) • Eight USB 2.0 ports: ― Four ports implemented with stacked back panel connectors (black) ― Four front panel ports implemented through two internal headers • Five Serial ATA (SATA) ports: ― One SATA 6.
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components on Intel Desktop Board DB75EN. Figure 1.
Intel Desktop Board DB75EN Technical Product Specification Table 2 lists the components identified in Figure 1. Table 2.
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. Figure 2.
Intel Desktop Board DB75EN Technical Product Specification 1.2 1.3 Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board DB75EN http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for Intel Desktop Board DB75EN http://ark.intel.com Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.
Product Description 1.3.1 Graphics Subsystem The board supports graphics through either the processor Intel HD Graphics or a PCI Express x16 add-in graphics card. 1.3.1.1 Processor Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for processors with Intel HD Graphics. 1.3.1.1.
Intel Desktop Board DB75EN Technical Product Specification 1.3.1.2 PCI Express x16 Graphics rd 3 generation Intel Core processor family processors support PCI Express 3.0, 2.x, and 1.x and 2nd generation Intel Core processor family processors support PCI Express 2.x and 1.x: • • • 20 PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of 1 GB/s each direction per lane.
Product Description 1.4 System Memory The board has four DIMM sockets and supports the following memory features: • • • • 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR3 SDRAM DIMMs. 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification) Two independent memory channels with interleaved mode support Unbuffered, single-sided or double-sided DIMMs with the following restriction: DIMMs with x16 organization are not supported.
Intel Desktop Board DB75EN Technical Product Specification For information about… Refer to: Tested Memory http://support.intel.com/support/motherboards/desktop/sb /CS-025414.htm 1.4.1 Memory Configurations The 3rd generation Intel Core processor family and 2nd generation Intel Core processor family processors support the following types of memory organization: • • • 22 Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications.
Product Description Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration NOTE For best memory performance always install memory in the blue DIMM sockets if installing only two DIMMs on your board.
Intel Desktop Board DB75EN Technical Product Specification Intel® B75 Express Chipset 1.5 Intel B75 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and Direct Media Interface (DMI) interconnect provides interfaces to the processor and the display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel B75 Express Chipset is a centralized controller for the board’s I/O paths. For information about Refer to The Intel B75 chipset http://www.intel.
Product Description 1.5.3 USB The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to 480 Mb/s. All ports are high-speed, full-speed, and low-speed capable. The PCH also contains an integrated eXtensible Host Controller Interface (xHCI) host controller which supports USB 3.0 ports. This controller allows data transfers up to 5 Gb/s.
Intel Desktop Board DB75EN Technical Product Specification The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 7 operating systems.
Product Description 1.8 Audio Subsystem The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following: • • Intel B75 Express Chipset Realtek ALC662 audio codec The audio subsystem has the following features: • • • • • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port.
Intel Desktop Board DB75EN Technical Product Specification 1.8.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include front panel audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors). The available configurable back panel audio connectors are shown in Figure 4.
Product Description 1.
Intel Desktop Board DB75EN Technical Product Specification 1.9.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com 1.9.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Item Description A Link LED (Green) B Data Rate LED (Green/Yellow) Figure 5.
Product Description 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • • Thermal and voltage monitoring Chassis intrusion detection 1.10.
Intel Desktop Board DB75EN Technical Product Specification 1.10.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description A Thermal diode, located on the processor die B Rear chassis fan header C Processor fan header D Front chassis fan header E Thermal diode, located on the Intel B75 PCH Figure 6.
Product Description 1.11 Intel® Security and Manageability Technologies Intel® Security and Manageability Technologies provide tools and resources to help small business owners and IT organizations protect and manage their assets in a business or institutional environment. NOTE Software with security and/or manageability capability is required to take advantage of Intel platform security and/or management technologies. Intel® Small Business Technology 1.11.
Intel Desktop Board DB75EN Technical Product Specification 1.11.3 Intel® Virtualization Technology for Directed I/O Intel® Virtualization Technology for Directed I/O (Intel® VT-d) allows addresses in incoming I/O device memory transactions to be remapped to different host addresses.
Product Description 1.11.5 Intel® Management Engine (Intel® ME) Software and Drivers Intel ME software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining Intel ME software and drivers Section 1.2 on page 18 1.11.5.1 Intel Management Engine “M” State LED The board has a blue-colored Intel ME “M” state LED (see Figure 7).
Intel Desktop Board DB75EN Technical Product Specification 1.
Product Description 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Intel Desktop Board DB75EN Technical Product Specification 1.12.1.2 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9.
Product Description LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. NOTE The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support. 1.12.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.
Intel Desktop Board DB75EN Technical Product Specification 1.12.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network.
Product Description 1.12.2.5 Wake from USB USB bus activity wakes the computer from an ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.12.2.6 PME# Signal Wake-up Support When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS). 1.12.2.
Intel Desktop Board DB75EN Technical Product Specification 1.12.2.11 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 8 shows the location of the standby power LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board.
2 Technical Reference 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 32 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory).
Intel Desktop Board DB75EN Technical Product Specification Figure 9.
Technical Reference 2.1.2 Memory Map Table 10 lists the system memory map. Table 10. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 33550336 K 100000 – 7FFC00000 32764 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used.
Intel Desktop Board DB75EN Technical Product Specification 2.2.1 Back Panel Connectors Figure 10 shows the location of the back panel connectors for the board. Item Description A B C D E F G H I J K PS/2 port USB 2.0 ports USB 2.0 ports VGA connector Parallel port DVI-D connector LAN port USB 3.0 ports Line in/surround Line out/front speakers Mic-in/center/subwoofer Figure 10.
Technical Reference 2.2.2 Component-side Connectors and Headers Figure 11 shows the locations of the component-side connectors and headers. Figure 11.
Intel Desktop Board DB75EN Technical Product Specification Table 11 lists the component-side connectors and headers identified in Figure 11. Table 11.
Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 12. Serial Port Header Pin Signal Name Pin Signal Name 1 DCD (Data Carrier Detect) 2 RXD# (Receive Data) 3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready) 5 Ground 6 DSR (Data Set Ready) 7 RTS (Request To Send) 8 CTS (Clear To Send) 9 RI (Ring Indicator) 10 Key (no pin) Table 13.
Intel Desktop Board DB75EN Technical Product Specification Table 16. Front Panel USB 3.
Technical Reference Table 19. Chassis Intrusion Header Pin Signal Name 1 Intruder# 2 Ground Table 20. Processor, Front, and Rear Chassis (4-Pin) Fan Headers Pin Signal Name 1 Ground (Note) 2 +12 V 3 FAN_TACH 4 FAN_CONTROL Note: These fan headers use Pulse Width Modulation control for fan speed. Table 21. LPC Debug Header Pin Signal Name Pin Signal Name 1 CK_33M_DEBUG 2 GND 3 PLTRST# 4 LFRAME# 5 LAD0 6 LAD1 7 LAD2 8 LAD3 9 GND 10 GND 11 +3.3 V 12 +3.
Intel Desktop Board DB75EN Technical Product Specification 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • • One PCI Express x16 (3.0/2.x/1.x) One PCI Express x1 (2.x/1.x) Two Conventional PCI (rev 2.3) Note the following considerations for the Conventional PCI bus connectors: • • The Conventional PCI bus connectors are bus master capable. SMBus signals are routed to the Conventional PCI bus connectors.
Technical Reference 2.2.2.3 Power Supply Connectors The board has the following power supply connectors: • • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable to the main power connector, leaving pins 11, 12, 23, and 24 unconnected.
Intel Desktop Board DB75EN Technical Product Specification 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 25 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header. Table 25.
Technical Reference 2.2.2.4.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED. Table 26 shows the possible states for a one-color LED. Table 27 shows the possible states for a two-color LED. Table 26. States for a One-Color Power LED LED State Description Off Power off/sleeping Steady Green Running Table 27.
Intel Desktop Board DB75EN Technical Product Specification 2.2.2.6 Front Panel USB 2.0 Headers Figure 13 is a connection diagram for the front panel USB 2.0 headers. NOTE • • The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 13. Connection Diagram for Front Panel USB 2.
Technical Reference 2.3 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 14 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 29 describes the jumper settings for the three modes: normal, configure, and recovery.
Intel Desktop Board DB75EN Technical Product Specification Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header 2.4 The Intel® MEBX reset header (see Figure 15) allows you to reset the Intel ME configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper (not supplied) will accomplish the following: • • Return all Intel ME parameters to their default values. Reset the Intel MEBX password to the default value (admin).
Technical Reference 2.5 2.5.1 Mechanical Considerations Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. Figure 16.
Intel Desktop Board DB75EN Technical Product Specification 2.6 Electrical Considerations 2.6.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator.
Technical Reference 2.6.2 Power Supervisor This board supports a version of the Power Supervisor feature which adds protection to the 5 VSB power rail by limiting potential electrical overstress events to a nondestructive level. 2.6.3 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.
Intel Desktop Board DB75EN Technical Product Specification CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Technical Reference Table 34 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 34.
Intel Desktop Board DB75EN Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Issue 2; Method I Case 3 50% electrical stress, 50 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the Intel Desktop Board DB75EN is 281,462 hours.
3 Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as ENB7510H.86A.
Intel Desktop Board DB75EN Technical Product Specification Table 37 lists the BIOS Setup program menu features. Table 37.
Overview of BIOS Features 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components.
Intel Desktop Board DB75EN Technical Product Specification To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions. 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment.
Overview of BIOS Features 3.6.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. For information about Refer to Intel Integrator Toolkit http://developer.intel.
Intel Desktop Board DB75EN Technical Product Specification 3.8 Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth. 3.8.1 Optical Drive Boot Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification.
Overview of BIOS Features 3.9 Adjusting Boot Speed These factors affect system boot speed: • • • Selecting and configuring peripherals properly Optimized BIOS boot parameters Enabling the Fast Boot feature 3.9.1 Peripheral Selection and Configuration The following techniques help improve system boot speed: • • • • Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds that minimizes hard drive startup delays.
Intel Desktop Board DB75EN Technical Product Specification 3.10 Hard Disk Drive Password Security Feature The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3.
Overview of BIOS Features NOTE Hard Disk Drive Password Security is not supported in PCH RAID mode. Secured hard disk drives attached to the system when the system is in PCH RAID mode will not be accessible due to the disabling of BIOS Hard Disk Drive Password support. 3.11 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer.
Intel Desktop Board DB75EN Technical Product Specification NOTE The BIOS complies with NIST Special Publication 800-147 BIOS Protection Guidelines / Recommendations of the National Institute of Standards and Technology. Refer to http://csrc.nist.gov/publications/nistpubs/800-147/NIST-SP800-147-April2011.pdf for more information. 3.
4 Error Messages and Beep Codes 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. 4.2 For information about Refer to The location of the onboard speaker Figure 1, page 15 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 43). Table 43. BIOS Beep Codes Type Pattern Frequency F2 Setup/F10 Boot Menu One 0.
Intel Desktop Board DB75EN Technical Product Specification 4.3 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 44). Table 44. Front-panel Power LED Blink Codes Type Pattern Note F2 Setup/F10 Boot Menu None Prompt 4.4 BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds.
Error Messages and Beep Codes 4.5 Port 80h Power On Self Test (POST) Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.
Intel Desktop Board DB75EN Technical Product Specification Table 47.
Error Messages and Beep Codes Table 47.
Intel Desktop Board DB75EN Technical Product Specification Table 47.
Error Messages and Beep Codes Table 47. Port 80h POST Codes (continued) Port 80 Code Progress Code Enumeration Removable Media 0xB8 Resetting removable media 0xB9 Disabling removable media 0xBA Detecting presence of a removable media (IDE, CDROM detection etc.
Intel Desktop Board DB75EN Technical Product Specification Table 48.
5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board DB75EN: • • • • • 5.1.
Intel Desktop Board DB75EN Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DB75EN is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).
Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.
Intel Desktop Board DB75EN Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
Intel Desktop Board DB75EN Technical Product Specification 5.1.4 China RoHS Intel Desktop Board DB75EN is a China RoHS-compliant product. The China Ministry of Information Industry (MII) stipulates that a material Self Declaration Table (SDT) must be included in a product’s user documentation. The SDT for Intel Desktop Board DB75EN is shown in Figure 18. Figure 18.
Regulatory Compliance and Battery Disposal Information 5.1.5 EMC Regulations Intel Desktop Board DB75EN complies with the EMC regulations stated in Table 50 when correctly installed in a compatible host system. Table 50. EMC Regulations Regulation Title FCC 47 CFR Part 15, Subpart B Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA) ICES-003 Interference-Causing Equipment Standard, Digital Apparatus.
Intel Desktop Board DB75EN Technical Product Specification • • Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.
Regulatory Compliance and Battery Disposal Information 5.1.6 e-Standby and ErP Compliance Intel Desktop Board DB75EN meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: • • • EPEAT* Korea e-Standby European Union Energy-related Products Directive 2013 (ErP) Lot 6 For information about Refer to Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.
Intel Desktop Board DB75EN Technical Product Specification 5.1.7 Regulatory Compliance Marks (Board Level) Intel Desktop Board DB75EN has the regulatory compliance marks shown in Table 51. Table 51. Regulatory Compliance Marks Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. CE mark.
Regulatory Compliance and Battery Disposal Information 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Intel Desktop Board DB75EN Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
Intel Desktop Board DB75EN Technical Product Specification 小心 如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保 規範來處理使用過的電池。 주의 배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야 하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다. THẬN TRỌNG Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể thực hiện được. Việc thải bỏ pin đã sử dụng phải tuân theo các quy định của địa phương về môi trường.
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