D5400XS Technical Product Specification

Contents
vii
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration ........................................... 17
4. Back Panel Audio Connector Options .................................................. 24
5. LAN Connector LED Locations............................................................ 26
6. Thermal Sensors and Fan Headers ..................................................... 28
7. Locations of Indicator LEDs............................................................... 36
8. Location of the Onboard Power Button................................................ 37
9. Detailed System Memory Address Map ............................................... 40
10. Back Panel Connectors ..................................................................... 42
11. Component-side Connectors and Headers ........................................... 43
12. Connection Diagram for Front Panel Header ........................................ 50
13. Connection Diagram for Front Panel USB Headers ................................ 52
14. Connection Diagram for IEEE 1394a Header ........................................ 52
15. Location of the Jumper Block............................................................. 53
16. Board Dimensions ........................................................................... 55
17. Localized High Temperature Zones..................................................... 59
Tables
1. Feature Summary............................................................................ 10
2. Components Shown in Figure 1 ......................................................... 13
3. Supported Memory Configurations ..................................................... 16
4. LAN Connector LED States ................................................................ 26
5. Effects of Pressing the Power Switch .................................................. 30
6. Power States and Targeted System Power........................................... 31
7. Wake-up Devices and Events ............................................................ 32
8. System Memory Map ....................................................................... 41
9. Component-side Connectors and Headers Shown in Figure 11................ 44
10. HD Audio Link Header ...................................................................... 45
11. Front Panel Audio Header ................................................................. 45
12. Serial ATA Connectors...................................................................... 45
13. S/PDIF Connector............................................................................ 45
14. Chassis Intrusion Header.................................................................. 46
15. Five Front and Rear Chassis (3-Pin) Fan Headers ................................. 46
16. Three Processor and Rear Chassis (4-Pin) Fan Headers ......................... 46
17. Back Panel CIR Emitter (Output) Header............................................. 46
18. Front Panel CIR Receiver (Input) Header............................................. 46
19. Auxiliary Front Panel Power/Sleep LED Header..................................... 47
20. Processor Core Power Connector........................................................ 48
21. Main Power Connector...................................................................... 49
22. Auxiliary PCI Express Graphics Power ................................................. 49
23. Front Panel Header .......................................................................... 50
24. States for a One-Color Power LED...................................................... 51
25. States for a Two-Color Power LED...................................................... 51