Technical Product Specification

Product Description

1.10 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired

for Management (WfM) specification. The board has several hardware management

features, including the following:

• Thermal and voltage monitoring

• Chassis intrusion detection

1.10.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Winbond

W83627DHG-A device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP

• SMBus interface