Technical product specification

Contents
ix
4 Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes ................................................................................................ 81
4.2 BIOS Error Messages ............................................................................................................................... 81
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance.......................................................................................................................... 83
5.1.1 Safety Standards .................................................................................................................... 83
5.1.2 European Union Declaration of Conformity Statement ........................................ 84
5.1.3 EMC Regulations .................................................................................................................... 85
5.1.4 e-Standby and ErP Compliance....................................................................................... 88
5.1.5 Regulatory Compliance Marks (Board Level) ............................................................. 89
5.2 Battery Disposal Information .............................................................................................................. 90
Figures
1. Major Board Components (Top)......................................................................................................... 13
2. Major Board Components (Bottom) ................................................................................................. 15
3. Block Diagram ............................................................................................................................................ 17
4. Memory Channel and SO-DIMM Configuration ........................................................................... 20
5. Flat Panel Connector on Bottom-side of the Board .................................................................. 24
6. Flat Panel Connectors on Top-side of the Board ....................................................................... 25
7. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ................................................................................ 30
8. LAN Connector LED Locations ............................................................................................................ 32
9. Thermal Solution and Fan Header .................................................................................................... 34
10. Location of the Standby Power LED ................................................................................................. 39
11. Front Panel Connectors ......................................................................................................................... 46
12. Back Panel Connectors .......................................................................................................................... 46
13. Headers (Top) ............................................................................................................................................ 47
14. Connectors and Headers (Bottom) ................................................................................................... 48
15. Connection Diagram for the Internal Power Supply Connector ........................................... 57
16
. Connection Diagram for Front Panel Header (2.0 mm Pitch) ................................................ 58
17. Low Speed Custom Solutions Header ............................................................................................. 60
18. Connection Diagram for Internal USB 2.0 Dual-Port Header (1.25 mm Pitch) ............... 61
19. Location of the BIOS Security Jumper ............................................................................................ 62
20. Intel MEBX Reset Header ...................................................................................................................... 64
21. Board Dimensions .................................................................................................................................... 65
22. Board Height Dimensions ..................................................................................................................... 66
23. Localized High Temperature Zones ................................................................................................. 68
24. Installation Area of the Thermal Pad ............................................................................................... 69
Tables
1. Feature Summary ..................................................................................................................................... 11
2. Components Shown in Figure 1 ......................................................................................................... 14
3. Components Shown in Figure 2 ......................................................................................................... 16