Technical product specification
Table Of Contents
- Intel® NUC Board NUC5i5RYB and Intel® NUC Board NUC5i3RYB Technical Product Specification
- Revision History
- Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® High Definition (Intel® HD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 Mini High Definition Multimedia Interface* (Mini HDMI*)
- 1.5.1.4 Mini DisplayPort*
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the Mini HDMI and Mini DisplayPort Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Real-Time Clock Subsystem
- 1.9 Audio Subsystem
- 1.10 LAN Subsystem
- 1.11 Hardware Management Subsystem
- 1.12 Power Management
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Connectors and Headers (Bottom)
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Regulatory Compliance and Battery Disposal Information
Technical Reference
53
A thermal pad has been installed for the bottom of the chassis to improve the thermal
performance when using M.2 devices that operate at higher temperatures. If the thermal pad ever
needs to be replaced, Figure 18 shows the installation area of the thermal pad for the Intel NUC
Kit NUC5i5RYK/NUC5i3RYK.
Item Description
A Thermal Pad
B Thermal Pad Installation Area
Figure 19. Installation Area of Thermal Pad for Intel NUC Kit NUC5i5RYK/NUC5i3RYK