Technical product specification
Table Of Contents
- Intel® NUC Board NUC5i5RYB and Intel® NUC Board NUC5i3RYB Technical Product Specification
- Revision History
- Contents
- 1 Product Description
- 1.1 Overview
- 1.2 Online Support
- 1.3 Processor
- 1.4 System Memory
- 1.5 Processor Graphics Subsystem
- 1.5.1 Integrated Graphics
- 1.5.1.1 Intel® High Definition (Intel® HD) Graphics
- 1.5.1.2 Video Memory Allocation
- 1.5.1.3 Mini High Definition Multimedia Interface* (Mini HDMI*)
- 1.5.1.4 Mini DisplayPort*
- 1.5.1.5 Multiple DisplayPort and HDMI Configurations
- 1.5.1.6 High-bandwidth Digital Content Protection (HDCP)
- 1.5.1.7 Integrated Audio Provided by the Mini HDMI and Mini DisplayPort Interfaces
- 1.5.1 Integrated Graphics
- 1.6 USB
- 1.7 SATA Interface
- 1.8 Real-Time Clock Subsystem
- 1.9 Audio Subsystem
- 1.10 LAN Subsystem
- 1.11 Hardware Management Subsystem
- 1.12 Power Management
- 2 Technical Reference
- 2.1 Memory Resources
- 2.2 Connectors and Headers
- 2.2.1 Front Panel Connectors
- 2.2.2 Back Panel Connectors
- 2.2.3 Connectors and Headers (Bottom)
- 2.3 BIOS Security Jumper
- 2.4 Mechanical Considerations
- 2.5 Electrical Considerations
- 2.6 Thermal Considerations
- 2.7 Reliability
- 2.8 Environmental
- 3 Overview of BIOS Features
- 4 Error Messages and Blink Codes
- 5 Regulatory Compliance and Battery Disposal Information
Technical Reference
51
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 50
o
C at the processor fan inlet is
recommended. If the internal ambient temperature exceeds 50
o
C, further thermal testing is
required to ensure components do not exceed their maximum case temperature.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating temperature, see
the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so
may result in shorter than expected product lifetime.