Technical product specification
Contents
ix
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 71
5.1.1 Safety Standards................................................................... 71
5.1.2 European Union Declaration of Conformity Statement ................ 72
5.1.3 Product Ecology Statements ................................................... 73
5.1.4 EMC Regulations ................................................................... 75
5.1.5 e-Standby and ErP Compliance ............................................... 78
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 79
5.2 Battery Disposal Information .............................................................. 80
Figures
1. Major Board Components (Top) .......................................................... 13
2. Major Board Components (Bottom) ..................................................... 15
3. Block Diagram .................................................................................. 17
4. Memory Channel and SO-DIMM Configuration ...................................... 21
5. LAN Connector LED Locations ............................................................. 27
6. Thermal Solution and Fan Header ....................................................... 29
7. Location of the Standby Power LED ..................................................... 34
8. Detailed System Memory Address Map ................................................ 36
9. Back Panel Connectors ...................................................................... 38
10. Connectors and Headers (Bottom) ...................................................... 39
11. Connection Diagram for Front Panel Header ......................................... 44
12. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 45
13. Location of the BIOS Configuration Setup Jumper ................................. 46
14. Board Dimensions ............................................................................. 48
15. Board Height Dimensions ................................................................... 49
16. Localized High Temperature Zones ..................................................... 51