Technical product specification

Intel NUC Board DN2820FY Technical Product Specification
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Figure 15 shows the height dimensions of the board.
Figure 15. Board Height Dimensions
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s
responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen.
2.5.2 Fan Header Current Capability
Table 12 lists the current capability of the fan header.
Table 12. Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan .25 A
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 58
o
C at the processor fan
inlet is recommended. If the internal ambient temperature exceeds 58
o
C, further
thermal testing is required to ensure components do not exceed their maximum case
temperature.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.