Technical product specification

Contents
ix
5.1.5 e-Standby and ErP Compliance ............................................... 66
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 67
5.2 Battery Disposal Information .............................................................. 68
Figures
1. Major Board Components (Top) .......................................................... 13
2. Major Board Components (Bottom) ..................................................... 15
3. Block Diagram .................................................................................. 17
4. Memory Channel and SO-DIMM Configuration ...................................... 20
5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ......................................... 23
6. LAN Connector LED Locations ............................................................. 26
7. Thermal Solution and Fan Header ....................................................... 28
8. Location of the Standby Power LED ..................................................... 33
9. Front Panel Connector ....................................................................... 36
10. Back Panel Connectors ...................................................................... 36
11. Connectors and Headers (Bottom) ...................................................... 37
12. Location of the CIR Sensor ................................................................ 40
13. Location of the BIOS Security Jumper ................................................. 41
14. Board Dimensions ............................................................................. 43
15. Board Height Dimensions ................................................................... 44
16. Localized High Temperature Zones ..................................................... 45
Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Components Shown in Figure 2 .......................................................... 16
4. Supported Memory Configurations ...................................................... 19
5. LAN Connector LED States ................................................................. 26
6. Effects of Pressing the Power Switch ................................................... 29
7. Power States and Targeted System Power ........................................... 30
8. W
ake-up Devices and Events ............................................................. 31
9. Connectors and Headers Shown in Figure 11 ........................................ 38
10. PCI Express Half-Mini Card Connector ................................................. 39
11. BIOS Security Jumper Settings ........................................................... 42
12. Fan Header Current Capability ............................................................ 44
13. Thermal Considerations for Components .............................................. 46
14. Tcontrol Values for Components ......................................................... 46
15. Environmental Specifications .............................................................. 47
16. Acceptable Drives/Media Types for BIOS Recovery ................................ 52
17. Boot Device Menu Options ................................................................. 54
18. Master Key and User Hard Drive Password Functions ............................ 56
19. Supervisor and User Password Functions ............................................. 57
20. Front-panel Power LED Blink Codes ..................................................... 59
21. BIOS Error Messages ........................................................................ 59