Intel® Desktop Board D2700MUD Technical Product Specification June 2012 Part Number: G34953-002 The Intel® Desktop Board D2700MUD may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D2700MUD Specification Update.
Revision History Revision Revision History Date ® -001 First release of the Intel Specification. -002 Specification Clarification Desktop Board D2700MUD Technical Product December 2011 June 2012 This product specification applies to only the standard Intel® Desktop Board D2700MUD with BIOS identifier MUCDT10N.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Board Identification Information Basic Desktop Board D2700MUD Identification Information AA Revision BIOS Revision Notes G32419-502 MUCDT10N.86A.0047 1,2 G32419-503 MUCDT10N.86A.0067 1,2 G32419-504 MUCDT10N.86A.0067 1,2 G32419-600 MUCDT10N.86A.0067 1,2 G32419-601 MUCDT10N.86A.0067 1,2 G32419-602 MUCDT10N.86A.0069 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2.
Intel Desktop Board D2700MUD Technical Product Specification iv
Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board D2700MUD. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board D2700MUD and its components to the vendors, system integrators, and other engineers and technicians who need this level of information.
Intel Desktop Board D2700MUD Technical Product Specification Other Common Notation vi # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value
Contents 1 Product Description 1.1 Overview ......................................................................................... 11 1.1.1 Feature Summary ................................................................. 11 1.1.2 Board Layout ........................................................................ 13 1.1.3 Block Diagram ...................................................................... 15 1.2 Online Support ............................................................................
Intel Desktop Board D2700MUD Technical Product Specification 2.7 Power Consumption .......................................................................... 63 2.7.1 Minimum Load Configuration................................................... 63 2.7.2 Maximum Load Configuration .................................................. 63 2.8 Reliability......................................................................................... 64 2.9 Environmental ..................................................
Contents Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. Major Board Components .................................................................. 13 Block Diagram .................................................................................. 15 Memory Channel and SO-DIMM Configuration ...................................... 19 LAN Connector LED Locations ............................................................. 25 Back Panel Audio Connectors .................................
Intel Desktop Board D2700MUD Technical Product Specification 22. Front Panel USB Header .................................................................... 49 23. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or Compatible Device Support ................................................................ 49 24. Power Connector .............................................................................. 51 25. Front Panel Header ..............................................................
1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of Intel Desktop Board D2700MUD. Table 2. Feature Summary Form Factor Mini-ITX (6.7 inches by 6.
Intel Desktop Board D2700MUD Technical Product Specification Table 2.
Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
Intel Desktop Board D2700MUD Technical Product Specification Table 3.
Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2.
Intel Desktop Board D2700MUD Technical Product Specification 1.2 1.3 Online Support To find information about… Visit this World Wide Web site: Intel Desktop Board D2700MUD http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for the Intel Desktop Board D2700MUD http://ark.intel.com Supported processors http://processormatch.intel.com Chipset information http://www.intel.
Product Description 1.3.1 Intel® D2700 Graphics Subsystem 1.3.1.1 Intel® Graphics Media Accelerator 3650 Graphics Controller (Intel® GMA) The Intel® GMA 3650 graphics controller features the following: • • • 640 MHz core frequency High quality texture engine DX9.3* and OpenGL* 3.0 compliant Hardware Pixel Shader 4.1 Vertex Shader Model 4.1 Video Blu-ray* 2.0 H.264 & VC1 hardware decoder PAVP 1.1c • HDCP1.
Intel Desktop Board D2700MUD Technical Product Specification 1.
Product Description Figure 3 illustrates the memory channel and SO-DIMM configuration. Figure 3.
Intel Desktop Board D2700MUD Technical Product Specification Intel® NM10 Express Chipset 1.5 The Intel NM10 Express Chipset provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a centralized controller for the board’s I/O paths. NOTE The board is designed to be passively cooled in a properly ventilated chassis.
Product Description 1.5.1.4 Flat Panel Interface (LVDS) The flat panel interface (LVDS) supports the following: • • Panel support up to WXGA+ (1440 x 900) 25 MHz to 112 MHz single–channel; @18 or 24 bpp • • • • • • TFT panel type Panel fitting, panning, and center mode CPIS 1.
Intel Desktop Board D2700MUD Technical Product Specification NOTE Support for flat panel display configuration complies with the following: 1. Internal flat panel display connectivity is disabled (and all parameters hidden) by default. 2. Internal flat panel display settings are not exposed through Intel® Integrator Toolkit or Intel® Integrator Assistant GUIs. 3. Internal flat panel display settings will not be overwritten by loading BIOS setup defaults. 4.
Product Description For information about Refer to Obtaining AHCI driver Section 1.2, page 16 The location of the SATA connectors Figure 11, page 43 1.6 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery.
Intel Desktop Board D2700MUD Technical Product Specification 1.
Product Description 1.8.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4). Figure 4. LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the Ethernet LAN subsystem is operating. Table 5. LAN Connector LED States LED Link/Activity (A) Link Speed (B) LED Color Green Green/Yellow LED State Condition Off LAN link is not established. On LAN link is established. Blinking LAN activity is occurring.
Intel Desktop Board D2700MUD Technical Product Specification 1.9 Audio Subsystem The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The audio subsystem consists of the following: • • Intel NM10 Express Chipset Realtek ALC662 audio codec The audio subsystem has the following features: • • • • • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port.
Product Description 1.9.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 16 1.9.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board.
Intel Desktop Board D2700MUD Technical Product Specification 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • • Thermal monitoring Voltage monitoring 1.10.
Product Description 1.10.2 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan header. Item Description A B C Remote thermal sensor DTS, located on the processor die System fan header Figure 6.
Intel Desktop Board D2700MUD Technical Product Specification 1.11 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan header LAN wake capabilities Instantly Available PC technology Wake from USB Wake from PS/2 devices Power Management Event signal (PME#) wake-up support WAKE# signal wake-up support 1.11.
Product Description 1.11.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Intel Desktop Board D2700MUD Technical Product Specification 1.11.1.2 Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 9.
Product Description 1.11.2 Hardware Support The board provides several power management hardware features, including: • • • • • • • • • Power connector Fan header LAN wake capabilities Instantly Available PC technology Wake from USB Wake from PS/2 devices Power Management Event signal (PME#) wake-up support WAKE# signal wake-up support +5V Standby Power Indicator LED LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.
Intel Desktop Board D2700MUD Technical Product Specification 1.11.2.3 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the hard drive(s) and fan will power off, the front panel LED will blink). When signaled by a wake-up device or event, the system quickly returns to its last known state.
Product Description 1.11.2.9 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. Figure 7.
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2 Technical Reference 2.1 Memory Map 2.1.1 Addressable Memory The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory).
Intel Desktop Board D2700MUD Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. Figure 8.
Technical Reference Table 9 lists the system memory map. Table 10. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used.
Intel Desktop Board D2700MUD Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors/headers have overcurrent protection: Back panel and front panel USB, VGA, serial, and PS/2. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis.
Technical Reference 2.2.1 Back Panel 2.2.1.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors. Item Description A DVI-D port B Parallel port C VGA port D PS/2 keyboard/mouse port E USB ports F LAN port G USB ports H Line in I Line out J Mic in Figure 9. Back Panel Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only.
Intel Desktop Board D2700MUD Technical Product Specification 2.2.1.2 I/O Shield The I/O shield provided with the board allows access to all back panel connectors and is compatible with standard mini-ITX and microATX chassis. As an added benefit for system configurations with wireless PCI Express Mini Card solutions, the I/O shield also provides pre-cut holes for user installation of up to two external wireless antennas. Figure 10 shows an I/O shield reference diagram. Figure 10.
Technical Reference 2.2.2 Component-side Connectors and Headers Figure 11 shows the locations of the component-side connectors and headers. Figure 11.
Intel Desktop Board D2700MUD Technical Product Specification Table 10 lists the component-side connectors and headers identified in Figure 11. Table 11. Component-side Connectors and Headers Shown in Figure 11 Item/callout from Figure 11 A 44 Description LVDS inverter panel voltage selection jumper B S/PDIF header C Processor core power connector (2 x 12) D LVDS panel connector E TPM header F SATA connector G SATA connector H System fan header I Front panel header J Front panel USB 2.
Technical Reference 2.2.2.1 Signal Tables for the Connectors and Headers Table 12. TPM Header Pin Signal Name Pin Signal Name 1 CK_33M_TPM_DIP 2 Ground 3 LFRAME# 4 Key (no pin) 5 PLTRST# 6 No connection 7 LAD3 8 LAD2 9 +3.3 V 10 LAD1 11 LAD0 12 Ground 13 No connection 14 No connection 15 +3.3 VSB 16 TPM_SERRQ 17 Ground 18 TPM_CLKRUN# 19 LPCPD# 20 No connection Table 13.
Intel Desktop Board D2700MUD Technical Product Specification Table 14. LVDS Data Connector 46 Pin Signal Name 1 LA_CLKN 3 LA_CLKP 5 EDID_3.3V 7 LA_DATAN0 9 LA_DATAP0 11 LA_DATAN1 13 LA_DATAP1 15 17 GND LA_DATAN2 19 LA_DATAP2 21 LA_DATAN3 23 LA_DATAP3 25 3.3 V/5 V/12 V 27 3.
Technical Reference Table 15. LVDS Panel Voltage Selection Jumper Voltage Jumper Setting Configuration 3.3 V 2 and 4 Jumper position for 3.3 V (default) 5V 6 and 4 Jumper position for 5 V 12 V 3 and 4 Jumper position for 12 V Table 16.
Intel Desktop Board D2700MUD Technical Product Specification Table 18. System Fan Header Pin Signal Name 1 Ground 2 +12 V (PWM controlled pulses) 3 Tach Table 19. SATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 20. Front Panel Wireless Activity LED Header Pin Signal Name 1 Ground 2 MINICARD_WLAN# Table 21.
Technical Reference Table 23. Front Panel USB Header Pin Signal Name Pin Signal Name 1 +5 VDC 2 +5 VDC 3 D- 4 D- 5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Connect Table 24.
Intel Desktop Board D2700MUD Technical Product Specification 2.2.2.2 Add-in Card Connectors The board has the following add-in card connectors: • • PCI Express Full-/Half-Mini Card slot Conventional PCI bus connector (with riser card support for up to two PCI cards) Note the following considerations for the Conventional PCI bus connector: • • The Conventional PCI bus connector is bus master capable. SMBus signals are routed to the Conventional PCI bus connector.
Technical Reference 2.2.2.3 Power Supply Connector The board has a 2 x 12 power connector (see Table 24). This board requires a TFX12V or SFX12V power supply. Table 25. Power Connector Pin Signal Name Pin Signal Name 1 +3.3 V 13 +3.3 V 2 +3.
Intel Desktop Board D2700MUD Technical Product Specification 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 25 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header. Table 26.
Technical Reference 2.2.2.4.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. 2.2.2.4.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a single- or dual-color LED.
Intel Desktop Board D2700MUD Technical Product Specification 2.2.2.5 Front Panel USB Headers Figure 13 and Figure 14 are connection diagrams for the front panel USB headers. NOTE • • The +5 VDC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. Figure 13. Connection Diagram for Front Panel USB Header Figure 14.
Technical Reference 2.3 BIOS Configuration Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 15 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 27 lists the jumper settings for the three modes: normal, configure, and recovery. Figure 15.
Intel Desktop Board D2700MUD Technical Product Specification Table 28. BIOS Configuration Jumper Settings 56 Function/Mode Jumper Setting Normal 1-2 The BIOS uses current configuration information and passwords for booting. Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Recovery None The BIOS attempts to recover the BIOS configuration. See Section 3.7 for more information on BIOS recovery.
Technical Reference 2.4 2.4.1 Mechanical Considerations Form Factor The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170 millimeters by 170 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the microATX specification. Figure 16.
Intel Desktop Board D2700MUD Technical Product Specification 2.5 Electrical Considerations 2.5.1 Fan Header Current Capability Table 28 lists the current capability of the fan header. Table 29. Fan Header Current Capability Fan Header Maximum Available Current System fan 1.5 A 2.5.2 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for the Conventional PCI slot.
Technical Reference CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 oC in an open chassis. Figure 17 shows the locations of the localized high temperature zones. Item Description A B C Processor voltage regulator area Intel Atom processor Intel NM10 Express Chipset Figure 17.
Intel Desktop Board D2700MUD Technical Product Specification Table 30. Thermal Considerations for Components Component Maximum Case Temperature Intel Atom processor 100 oC Processor voltage regulator area 85 oC Intel NM10 Express Chipset 113 oC Memory SO-DIMM 85 oC For information about Refer to Processor datasheets and specification updates Section 1.2, page 16 2.6.
Technical Reference 2.6.1.2 Thermal Specifications Guideline Terms Requirements TA ≤ 50 °C TJ ≤ 100 °C ΨJA ≤ 3.85 °C/W TIM Honeywell PCM45F TDP 10 W TA external ≤ 35 °C 2.6.1.3 Heatsink Design Guideline Maximum heatsink size (Note) 87 x 52 x 29 mm Heatsink mass ≤ 63.6 grams Retention type Spring loaded fasteners Heatsink preload 13.2 lb Note: Refers to the heatsink installed on the board. 2.6.1.
Intel Desktop Board D2700MUD Technical Product Specification Figure 18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not Restricted) For all chassis configurations, the heatsink performance parameter, ΨJA should be less than 3.85 °C/W. The detail thermal measurement metrology is described in the TMSDG. For chassis that fail to meet the thermal specifications guideline highlighted above, an actively cooled heatsink solution should be used.
Technical Reference 2.7 Power Consumption Power measurements were performed to determine bare minimum and likely maximum power requirements from the board, as well as attached devices, in order to facilitate power supply rating estimates for specific system configurations. 2.7.1 Minimum Load Configuration Minimum load refers to the power demand placed on the power supply when using a bare system configuration with minimal power requirement conditions.
Intel Desktop Board D2700MUD Technical Product Specification • • USB keyboard and mouse Back and front panel host-powered USB devices (other than keyboard and mouse) • Load: continuous read/write activity on external drive/peripheral LAN linked at 1000 Mb/s • Load: continuous read/write benchmark on remote share All on board peripherals enabled (serial, parallel, audio, …) Table 32. Maximum Load Configuration Current and Power Results 2.8 Output Voltage 3.
3 Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as MUCDT10N.86A.
Intel Desktop Board D2700MUD Technical Product Specification Table 33 lists the BIOS Setup program menu features. Table 34.
Overview of BIOS Features 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components.
Intel Desktop Board D2700MUD Technical Product Specification 3.5 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3.
Overview of BIOS Features 3.6 BIOS Updates The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site: • • • Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive. Intel® Flash Memory Update Utility, which requires booting from DOS.
Intel Desktop Board D2700MUD Technical Product Specification 3.6.2 Custom Splash Screen During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel® Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. For information about Refer to Intel Integrator Toolkit http://developer.intel.
Overview of BIOS Features 3.7.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: • • • Video adapter Keyboard Mouse 3.7.4 Changing the Default Boot Device During POST Pressing the key during POST causes a boot device menu to be displayed.
Intel Desktop Board D2700MUD Technical Product Specification 3.8.2 BIOS Boot Optimizations Use of the following BIOS Setup program settings reduces the POST execution time. • • In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time. In the Peripheral Configuration submenu, disable the LAN device if it will not be used.
Overview of BIOS Features 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: • • • • • • • The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
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4 Board Status and Error Messages 4.1 BIOS Beep Codes The BIOS uses audible beep codes to signal status messages and error messages indicating recoverable errors that occur during the POST. The beep codes are listed in Table 38. These beep codes can be heard through a speaker attached to the board’s line out audio jack (see Figure 5, B on page 27). Table 39. BIOS Beep Codes Type Pattern Frequency BIOS update in progress None Video error (Note) On-off (1.0 2.
Intel Desktop Board D2700MUD Technical Product Specification 4.2 Front-panel Power LED Blink Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 39). Table 40. Front-panel Power LED Blink Codes Type Pattern Note BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.
Board Status and Error Messages 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
Intel Desktop Board D2700MUD Technical Product Specification Table 43.
Board Status and Error Messages Table 43.
Intel Desktop Board D2700MUD Technical Product Specification Table 43.
Board Status and Error Messages Table 44.
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5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board D2700MUD: • • • • • 5.1.
Intel Desktop Board D2700MUD Technical Product Specification 5.1.2 European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board D2700MUD is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).
Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.
Intel Desktop Board D2700MUD Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации. Пожалуйста, обратитесь на веб-сайт http://www.intel.
Intel Desktop Board D2700MUD Technical Product Specification FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E.
Regulatory Compliance and Battery Disposal Information Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
Intel Desktop Board D2700MUD Technical Product Specification 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance Intel Desktop Board D2700MUD meets the ENERGY STAR requirements listed in Table 46 when used in corresponding system configurations. Table 47. ENERGY STAR Requirements Typical Electricity Consumption (TEC) Criteria ENERGY STAR Specification Computer Type Required States Capability Adjustments v4.0 Desktop Computer Idle State (Cat A) N/A v4.
Regulatory Compliance and Battery Disposal Information 5.1.6 Regulatory Compliance Marks (Board Level) Intel Desktop Board D2700MUD has the regulatory compliance marks shown in Table 47. Table 48. Regulatory Compliance Marks Description Mark UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. CE mark.
Intel Desktop Board D2700MUD Technical Product Specification 5.2 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible.
Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled.
Intel Desktop Board D2700MUD Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.
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