Technical Product Specification

Contents
ix
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 83
5.1.1 Safety Standards................................................................... 83
5.1.2 European Union Declaration of Conformity Statement ................ 84
5.1.3 Product Ecology Statements ................................................... 85
5.1.4 EMC Regulations ................................................................... 87
5.1.5 e-Standby and ErP Compliance ............................................... 90
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 91
5.2 Battery Disposal Information .............................................................. 92
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and SO-DIMM Configuration ...................................... 19
4. LAN Connector LED Locations ............................................................. 26
5. Back Panel Audio Connectors ............................................................. 28
6. Thermal Sensors and Fan Header ....................................................... 30
7. Location of the Standby Power Indicator LED ....................................... 36
8. Detailed System Memory Address Map ................................................ 38
9. Back Panel Connectors ...................................................................... 41
10. I/O Shield Reference Diagram ............................................................ 42
11. Component-side Connectors and Headers ............................................ 43
12. Connection Diagram for Front Panel Header ......................................... 52
13. Connection Diagram for Front Panel USB 2.0 Header ............................. 54
14. Connection Diagram for Front Panel USB 2.0 Header with Intel Z-USB
Solid-State Drive or Compatible Device Support ................................... 54
15. Location of the BIOS Configuration Jumper Block .................................. 55
16. Board Dimensions ............................................................................. 57
17. Localized High Temperature Zones ..................................................... 59
18. Fan Location Guide for Chassis Selection (Chassis Orientation is
Not Restricted) ................................................................................. 62
Tables
1. Feature Summary ............................................................................. 11
2. Board Components Shown in Figure 1 ................................................. 14
3. Supported Memory Configurations
1
..................................................... 18
4. LAN Connector LED States ................................................................. 26
5. Audio Jack Support ........................................................................... 27
6. Effects of Pressing the Power Switch ................................................... 31
7. Power States and Targeted System Power ........................................... 32
8. Wake-up Devices and Events ............................................................. 33
9. System Memory Map ........................................................................ 39
10. Component-side Connectors and Headers Shown in Figure 11 ................ 44
11. TPM Header ..................................................................................... 45