Datasheet
Datasheet, Volume 1 5
4.2.1 Enhanced Intel
®
SpeedStep
®
Technology.................................................. 52
4.2.2 Low-Power Idle States ............................................................................ 53
4.2.3 Requesting Low-Power Idle States ............................................................ 54
4.2.4 Core C-states......................................................................................... 55
4.2.4.1 Core C0 State........................................................................... 55
4.2.4.2 Core C1 / C1E State .................................................................. 55
4.2.4.3 Core C3 State........................................................................... 55
4.2.4.4 Core C6 State........................................................................... 55
4.2.4.5 Core C7 State........................................................................... 56
4.2.4.6 C-State Auto-Demotion.............................................................. 56
4.2.5 Package C-States ................................................................................... 56
4.2.5.1 Package C0 .............................................................................. 58
4.2.5.2 Package C1/C1E ....................................................................... 58
4.2.5.3 Package C3 State...................................................................... 58
4.2.5.4 Package C6 State...................................................................... 58
4.2.5.5 Package C7 State...................................................................... 59
4.2.5.6 Dynamic L3 Cache Sizing ........................................................... 59
4.3 Integrated Memory Controller (IMC) Power Management ........................................59
4.3.1 Disabling Unused System Memory Outputs ................................................ 59
4.3.2 DRAM Power Management and Initialization ............................................... 60
4.3.2.1 Initialization Role of CKE ............................................................ 61
4.3.2.2 Conditional Self-Refresh............................................................. 61
4.3.2.3 Dynamic Power Down Operation ................................................. 62
4.3.2.4 DRAM I/O Power Management .................................................... 62
4.3.3 DDR Electrical Power Gating (EPG)............................................................ 62
4.4 PCI Express* Power Management ........................................................................ 63
4.5 DMI Power Management..................................................................................... 63
4.6 Graphics Power Management .............................................................................. 63
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)
(also known as CxSR) ............................................................................. 63
4.6.2 Intel
®
Graphics Performance Modulation Technology (Intel
®
GPMT) ..............63
4.6.3 Graphics Render C-State ......................................................................... 64
4.6.4 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) .................................. 64
4.6.5 Intel
®
Graphics Dynamic Frequency.......................................................... 64
4.6.6 Display Power Savings Technology 6.0 (DPST) ........................................... 65
4.6.7 Automatic Display Brightness (ADB).......................................................... 65
4.6.8 Intel
®
Seamless Display Refresh Rate Switching
Technology (Intel
®
SDRRS Technology) ....................................................65
4.7 Graphics Thermal Power Management .................................................................. 66
5 Thermal Management..............................................................................................67
5.1 Thermal Considerations...................................................................................... 67
5.2 Intel
®
Turbo Boost Technology Power Monitoring................................................... 68
5.3 Intel
®
Turbo Boost Technology Power Control ....................................................... 68
5.3.1 Package Power Control............................................................................ 68
5.3.2 Power Plane Control................................................................................ 70
5.3.3 Turbo Time Parameter ............................................................................ 70
5.4 Configurable Thermal Design Power (cTDP) and
Low Power Mode (LPM) ...................................................................................... 70
5.4.1 Configurable TDP (cTDP) ......................................................................... 70
5.4.2 Low Power Mode .................................................................................... 71
5.5 Thermal and Power Specifications........................................................................ 72
5.6 Thermal Management Features ........................................................................... 75
5.6.1 Adaptive Thermal Monitor........................................................................ 75
5.6.1.1 TCC Activation Offset................................................................. 76
5.6.1.2 Frequency / Voltage Control ....................................................... 76
5.6.1.3 Clock Modulation....................................................................... 78