Datasheet

Ballout and Package Information
Intel
®
Atom™ Processor E6xx Series Datasheet
281
14.0 Ballout and Package Information
The Intel
®
Atom™ Processor E6xx Series comes in an 22 mm x 22 mm Flip-Chip Ball Grid Array
(FCBGA) package and consists of a silicon die mounted face down on an organic substrate populated
with 676 solder balls on the bottom side. Capacitors may be placed in the area surrounding the die.
Because the die-side capacitors are electrically conductive, and only slightly shorter than the die
height, care should be taken to avoid contacting the capacitors with electrically conductive materials.
Doing so may short the capacitors and possibly damage the device or render it inactive.
The use of an insulating material between the capacitors and any thermal solution should be
considered to prevent capacitor shorting. An exclusion, or keep out zone, surrounds the die and
capacitors, and identifies the contact area for the package. Care should be taken to avoid contact with
the package inside this area.
Refer to the Intel
®
Atom™ Processor E6xx Series Thermal and Mechanical Design Guidelines for
details on package mechanical dimensions and tolerance, as well as other key package attributes.
Dimensions:
• Package parameters: 22 mm x 22 mm
•Ball Count: 676
• Land metal diameter: 500 microns
• Solder resist opening: 430 microns
Tolerances:
•.X - ± 0.1
• .XX - ± 0.05
• Angles - ± 1.0 degrees