user manual
Table Of Contents
- Contents
- Figures
- Tables
- Revision History
- Introduction
- Packaging Technology
- Thermal Specifications
- Thermal Simulation
- Thermal Metrology
- Reference Thermal Solution
- Appendix A: Thermal Solution Component Suppliers
- Appendix B: Mechanical Drawings
Thermal Metrology
R
16 Intel
®
955X Express Chipset Thermal/Mechanical Design Guide
Figure 5-1. Thermal Solution Decision Flowchart
Therm_Solution_Flow
Attach
thermocouples using
recommended
metrology. Setup the
system in the desired
configuration.
Tdie >
Specification?
Heatsink
Required
Select Heatsink
End
Start
Run the Power
program and
monitor the
device die
temperature.
Attach device
to board using
normal reflow
process.
No
Yes
Figure 5-2. Zero Degree Angle Attach Methodology
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
0_Angle_Attach_Method
Cement +
Thermocouple Bead
Die
Thermocouple
Wire
Substrate
NOTE: Not to scale.
§