Datasheet
Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families 9
Datasheet Volume One of Two
6-7 DMI2 and PCI Express Port 0 Signals ................................................................. 122
6-8 Intel QPI Port 0 and 1 Signals........................................................................... 122
6-9 Intel QPI Miscellaneous Signals ......................................................................... 122
6-10 PECI Signals................................................................................................... 123
6-11 System Reference Clock (BCLK{0/1}) Signals ..................................................... 123
6-12 JTAG and TAP Signals ...................................................................................... 123
6-13 SVID Signals .................................................................................................. 124
6-14 Processor Asynchronous Sideband Signals .......................................................... 124
6-15 Miscellaneous Signals ...................................................................................... 127
6-16 Power and Ground Signals................................................................................ 127
7-1 Power and Ground Lands.................................................................................. 131
7-2 SVID Address Usage........................................................................................ 135
7-3 VR12.0 Reference Code Voltage Identification (VID) Table .................................... 135
7-4 Signal Description Buffer Types......................................................................... 136
7-5 Signal Groups................................................................................................. 137
7-6 Signals with On-Die Termination ....................................................................... 139
7-7 Power-On Configuration Option Lands ................................................................ 140
7-8 Fault Resilient Booting (Output Tri-State) Signals ................................................ 141
7-9 Processor Absolute Minimum and Maximum Ratings............................................. 142
7-10 Storage Condition Ratings ................................................................................ 143
7-11 Voltage Specification........................................................................................ 143
7-12 Processor Current Specifications........................................................................ 145
7-13 Processor VCC Static and Transient Tolerance ..................................................... 146
7-14 VCC Overshoot Specifications............................................................................ 149
7-15 DDR3 and DDR3L Signal DC Specifications.......................................................... 149
7-16 PECI DC Specifications..................................................................................... 151
7-17 System Reference Clock (BCLK{0/1}) DC Specifications ....................................... 151
7-18 SMBus DC Specifications .................................................................................. 152
7-19 JTAG and TAP Signals DC Specifications ............................................................. 152
7-20 Serial VID Interface (SVID) DC Specifications...................................................... 152
7-21 Processor Asynchronous Sideband DC Specifications ............................................ 153
7-22 Miscellaneous Signals DC Specifications.............................................................. 154
7-23 Processor I/O Overshoot/Undershoot Specifications ............................................. 157
7-24 Processor Sideband Signal Group Overshoot/Undershoot Tolerance........................ 159
8-1 Land Name..................................................................................................... 161
8-2 Land Number.................................................................................................. 185
9-1 Processor Package Sizes................................................................................... 212
9-2 Processor Loading Specifications ....................................................................... 217
9-3 Package Handling Guidelines............................................................................. 217
9-4 Processor Materials.......................................................................................... 218
10-1 PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution ..................... 230
10-2 PWM Fan Characteristics for Active Thermal Solution............................................ 230
10-3 PWM Fan Connector Pin and Wire Description...................................................... 231
10-4 Server Thermal Solution Boundary Conditions ..................................................... 232