Datasheet
Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families 7
Datasheet Volume One of Two
2-40 Caching Agent TOR Read Data ............................................................................60
2-41 DTS Thermal Margin Read ..................................................................................60
2-42 Processor ID Construction Example......................................................................61
2-43 RdIAMSR().......................................................................................................62
2-44 PCI Configuration Address..................................................................................64
2-45 RdPCIConfig()...................................................................................................65
2-46 PCI Configuration Address for local accesses.........................................................66
2-47 RdPCIConfigLocal()............................................................................................ 66
2-48 WrPCIConfigLocal() ...........................................................................................68
2-49 The Processor PECI Power-up Timeline() ..............................................................70
2-50 Temperature Sensor Data Format........................................................................76
4-1 Idle Power Management Breakdown of the Processor Cores.....................................91
4-2 Thread and Core C-State Entry and Exit ............................................................... 91
4-3 Package C-State Entry and Exit...........................................................................95
5-1 TCase Temperature Thermal Profile ................................................................... 106
5-2 Digital Thermal Sensor DTS Thermal Profile ........................................................ 108
5-3 Embedded Case Temperature Thermal Profile...................................................... 110
5-4 Embedded DTS Thermal Profile ......................................................................... 111
5-5 Case Temperature (TCASE) Measurement Location .............................................. 112
5-6 Frequency and Voltage Ordering........................................................................ 115
7-1 Input Device Hysteresis ................................................................................... 130
7-2 VR Power-State Transitions............................................................................... 134
7-3 Processor VCC Static and Transient Tolerance Loadlines ....................................... 147
7-4 Load Current Versus Time ................................................................................ 148
7-5 VCC Overshoot Example Waveform.................................................................... 149
7-6 BCLK{0/1} Differential Clock Crosspoint Specification .......................................... 155
7-7 BCLK{0/1} Differential Clock Measurement Point for Ringback .............................. 155
7-8 BCLK{0/1} Single Ended Clock Measurement Points for Absolute Cross Point
and Swing...................................................................................................... 155
7-9 Maximum Acceptable Overshoot/Undershoot Waveform........................................ 159
9-1 Processor Package Assembly Sketch .................................................................. 211
9-2 Processor PMD Package A (52.5 x 45 mm) Sheet 1 of 2........................................ 213
9-3 Processor PMD Package A (52.5 x 45 mm) Sheet 2 of 2........................................ 214
9-4 Processor PMD Package B (52.5 x 51 mm) Sheet 1 of 2........................................ 215
9-5 Processor PMD Package B (52.5 x 51 mm) Sheet 2 of 2........................................ 216
9-6 Processor Top-Side Markings ........................................................................... 218
10-1 STS200C Passive/Active Combination Heat Sink (with Removable Fan)................... 220
10-2 STS200C Passive/Active Combination Heat Sink (with Fan Removed) ..................... 220
10-3 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks................................ 221
10-4 Boxed Processor Motherboard Keepout Zones (1 of 4).......................................... 222
10-5 Boxed Processor Motherboard Keepout Zones (2 of 4).......................................... 223
10-6 Boxed Processor Motherboard Keepout Zones (3 of 4).......................................... 224
10-7 Boxed Processor Motherboard Keepout Zones (4 of 4).......................................... 225
10-8 Boxed Processor Heat Sink Volumetric (1 of 2).................................................... 226
10-9 Boxed Processor Heat Sink Volumetric (2 of 2).................................................... 227
10-10 4-Pin Fan Cable Connector (For Active Heat Sink)................................................ 228
10-11 4-Pin Base Baseboard Fan Header (For Active Heat Sink)...................................... 229
10-12 Fan Cable Connector Pin Out For 4-Pin Active Thermal Solution ............................. 231