Datasheet
Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families 5
Datasheet Volume One of Two
6.9 Processor Asynchronous Sideband and Miscellaneous Signals ................................ 124
6.10 Processor Power and Ground Supplies................................................................ 127
7 Electrical Specifications......................................................................................... 129
7.1 Processor Signaling ......................................................................................... 129
7.1.1 System Memory Interface Signal Groups ................................................. 129
7.1.2 PCI Express Signals.............................................................................. 129
7.1.3 DMI2/PCI Express Signals ..................................................................... 129
7.1.4 Intel
®
QuickPath Interconnect ............................................................... 129
7.1.5 Platform Environmental Control Interface (PECI) ...................................... 130
7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 130
7.1.7 JTAG and Test Access Port (TAP) Signals ................................................. 131
7.1.8 Processor Sideband Signals ................................................................... 131
7.1.9 Power, Ground and Sense Signals........................................................... 131
7.1.10 Reserved or Unused Signals................................................................... 136
7.2 Signal Group Summary.................................................................................... 136
7.3 Power-On Configuration (POC) Options............................................................... 140
7.4 Fault Resilient Booting (FRB)............................................................................. 140
7.5 Mixing Processors............................................................................................ 141
7.6 Flexible Motherboard Guidelines (FMB)............................................................... 142
7.7 Absolute Maximum and Minimum Ratings ........................................................... 142
7.7.1 Storage Condition Specifications............................................................. 142
7.8 DC Specifications ............................................................................................ 143
7.8.1 Voltage and Current Specifications.......................................................... 143
7.8.2 Die Voltage Validation........................................................................... 148
7.8.3 Signal DC Specifications........................................................................ 149
7.9 Signal Quality................................................................................................. 156
7.9.1 DDR3 Signal Quality Specifications ......................................................... 156
7.9.2 I/O Signal Quality Specifications............................................................. 156
7.9.3 Intel
®
QuickPath Interconnect Signal Quality Specifications ....................... 156
7.9.4 Input Reference Clock Signal Quality Specifications................................... 156
7.9.5 Overshoot/Undershoot Tolerance............................................................ 157
8 Processor Land Listing........................................................................................... 161
8.1 Listing by Land Name ...................................................................................... 161
8.2 Listing by Land Number ................................................................................... 185
9 Package Mechanical Specifications ........................................................................ 211
9.1 Package Size and SKUs.................................................................................... 211
9.2 Package Mechanical Drawing (PMD)................................................................... 212
9.3 Processor Component Keep-Out Zones............................................................... 217
9.4 Package Loading Specifications ......................................................................... 217
9.5 Package Handling Guidelines............................................................................. 217
9.6 Package Insertion Specifications........................................................................ 217
9.7 Processor Mass Specification............................................................................. 218
9.8 Processor Materials.......................................................................................... 218
9.9 Processor Markings.......................................................................................... 218
10 Boxed Processor Specifications ............................................................................. 219
10.1 Introduction ................................................................................................... 219
10.1.1 Available Boxed Thermal Solution Configurations...................................... 219
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution)...................................... 219
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions).................................... 220
10.2 Mechanical Specifications ................................................................................. 221
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones........ 221
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS) ...... 230