Datasheet

4Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families
Datasheet Volume One of Two
3.2.3 AES Instructions.....................................................................................82
3.2.4 Execute Disable Bit .................................................................................83
3.3 Intel
®
Secure Key..............................................................................................83
3.4 Intel
®
OS Guard................................................................................................83
3.5 Intel® Hyper-Threading Technology.....................................................................83
3.6 Intel
®
Turbo Boost Technology............................................................................84
3.6.1 Intel
®
Turbo Boost Operating Frequency....................................................84
3.7 Enhanced Intel SpeedStep® Technology...............................................................84
3.8 Intel® Intelligent Power Technology.....................................................................85
3.9 Intel® Advanced Vector Extensions (Intel® AVX) ..................................................85
3.10 Intel
®
Dynamic Power Technology .......................................................................86
4 Power Management .................................................................................................87
4.1 ACPI States Supported.......................................................................................87
4.1.1 System States........................................................................................87
4.1.2 Processor Package and Core States...........................................................87
4.1.3 Integrated Memory Controller States.........................................................88
4.1.4 DMI2/PCI Express* Link States.................................................................89
4.1.5 Intel® QuickPath Interconnect States........................................................89
4.1.6 G, S, and C State Combinations................................................................89
4.2 Processor Core/Package Power Management .........................................................90
4.2.1 Enhanced Intel SpeedStep® Technology....................................................90
4.2.2 Low-Power Idle States.............................................................................90
4.2.3 Requesting Low-Power Idle States ............................................................91
4.2.4 Core C-states.........................................................................................92
4.2.5 Package C-States ...................................................................................93
4.2.6 Package C-State Power Specifications........................................................97
4.2.7 Processor Package Power Specifications.....................................................97
4.3 System Memory Power Management ....................................................................98
4.3.1 CKE Power-Down....................................................................................98
4.3.2 Self Refresh...........................................................................................99
4.3.3 DRAM I/O Power Management..................................................................99
4.4 DMI2/PCI Express* Power Management..............................................................100
5 Thermal Management Specifications......................................................................101
5.1 Package Thermal Specifications .........................................................................101
5.1.1 Thermal Specifications...........................................................................101
5.1.2 TCASE and DTS Based Thermal Specifications...........................................103
5.1.3 Processor Operational Thermal Specifications ...........................................104
5.1.4 Embedded Server Thermal Profiles..........................................................108
5.1.5 Thermal Metrology................................................................................111
5.2 Processor Core Thermal Features.......................................................................112
5.2.1 Processor Temperature..........................................................................112
5.2.2 Adaptive Thermal Monitor......................................................................112
5.2.3 On-Demand Mode.................................................................................115
5.2.4 PROCHOT_N Signal...............................................................................116
5.2.5 THERMTRIP_N Signal ............................................................................116
5.2.6 Integrated Memory Controller (IMC) Thermal Features...............................117
6 Signal Descriptions ................................................................................................119
6.1 System Memory Interface Signals......................................................................119
6.2 PCI Express* Based Interface Signals.................................................................120
6.3 DMI2/PCI Express* Port 0 Signals......................................................................122
6.4 Intel® QuickPath Interconnect Signals ...............................................................122
6.5 PECI Signal.....................................................................................................123
6.6 System Reference Clock Signals ........................................................................123
6.7 JTAG and TAP Signals.......................................................................................123
6.8 Serial VID Interface (SVID) Signals....................................................................124