Datasheet

Overview
22 Intel
®
Xeon
®
Processor E5-1600/E5-2600/E5-4600 v2 Product Families
Datasheet Volume One of Two
Intel
®
Turbo Boost
Technology
Intel
®
Turbo Boost Technology is a way to automatically run the processor
core faster than the marked frequency if the part is operating under power,
temperature, and current specifications limits of the Thermal Design
Power (TDP). This results in increased performance of both single and multi-
threaded applications.
Intel® TXT Intel® Trusted Execution Technology
Intel® Virtualization
Technology (Intel® VT)
Processor virtualization which when used in conjunction with Virtual Machine
Monitor software enables multiple, robust independent software environments
inside a single platform.
Intel® VT-d Intel® Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a
hardware assist, under system software (Virtual Machine Manager or OS)
control, for enabling I/O device virtualization. Intel VT-d also brings robust
security by providing protection from errant DMAs by using DMA remapping, a
key feature of Intel VT-d.
Intel
®
Xeon
®
processor
E5-1600 v2 product family
Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel
®
Core™ Processor Family design. It is the next generation processor for use in
Intel
®
Xeon
®
processor E5-1600 v2/E5-2600 v2 product families-based
platforms. Intel
®
Xeon
®
processor E5-1600 v2 product family supports
workstation platforms only.
Intel
®
Xeon
®
processor
E5-2600 v2 product family
Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel
®
Core™ Processor Family design. It is the next generation processor for use in
Intel
®
Xeon
®
processor E5-1600 v2/E5-2600 v2 product families-based
platforms. Intel
®
Xeon
®
processor E5-2600 v2 product family supports
workstation, Efficient Performance server, and HPC platforms.
Inte
l®
Xeon
®
processor
E5-4600 v2 product family
Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel
®
Core™ Processor Family design. It is the next generation processor for use in
Inte
l®
Xeon
®
processor E5-4600 v2 product family platforms. Inte
l®
Xeon
®
processor E5-4600 v2 product family supports scalable server and HPC platforms
for two or more processors, including glueless four-way platforms.
Integrated Heat Spreader
(IHS)
A component of the processor package used to enhance the thermal
performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Jitter Any timing variation of a transition edge or edges from the defined Unit
Interval (UI).
IOV I/O Virtualization
LGA2011-0 Socket The LGA2011-0 land FCLGA12 package mates with the system board through
this surface mount, LGA2011-0 contact socket.
LLC Last Level Cache
LRDIMM Load Reduced Dual In-line Memory Module
NCTF Non-Critical to Function: NCTF locations are typically redundant ground or non-
critical reserved, so the loss of the solder joint continuity at end of life conditions
will not affect the overall product functionality.
NEBS Network Equipment Building System. NEBS is the most common set of
environmental design guidelines applied to telecommunications equipment in the
United States.
PCH Platform Controller Hub. The next generation chipset with centralized platform
capabilities including the main I/O interfaces along with display connectivity,
audio features, power management, manageability, security and storage
features.
PCU Power Control Unit
PCI Express* 3.0 The third generation PCI Express* specification that operates at twice the speed
of PCI Express* 2.0 (8 Gb/s); however, PCI Express* 3.0 is completely backward
compatible with PCI Express* 1.0 and 2.0.
PCI Express 3 PCI Express* Generation 3.0
PCI Express 2 PCI Express* Generation 2.0
PCI Express PCI Express* Generation 2.0/3.0
PECI Platform Environment Control Interface
Term Description